CETR, a privately held tribology and mechanical testing company headquartered in Campbell, CA, with 30 employees, has now become a part of the Bruker Nano Surfaces division, joining the current AFM (atomic force microscope) and SOM (stylus and optical metrology) businesses.
Roche and Arizona Technology Enterprises (AzTE) announced today an agreement to license several technologies developed by Dr. Stuart Lindsay at the Biodesign Institute at Arizona State University and Dr. Colin Nuckolls of the Columbia University Nanoscience Center for the development of a revolutionary DNA sequencing system.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and the leading supplier of MEMS (Micro-Electro-Mechanical Systems) for consumer and portable applications, is the world's first manufacturer to have implemented Through-Silicon Via technology (TSV) in high-volume MEMS production.
This latest addition to the AltaSight family of high-performance, non-contact inspection and analysis products offers a full array of dark-field, reflectivity and topographical inspection technologies to provide 100% defect detection in a single pass through the system.
Imec announces that it has successfully qualified a chipset consisting of custom high-quality EUV sensor dies. These are now being integrated in ASML's NXE:3100 EUV lithography tools in the field, improving the tools' overlay and critical dimension tool performance.
Nanostart-Holding MagForce AG, a leading medical technology company focusing on nanomedicine in oncology, announced today the treatment of a recurrent glioblastoma patient with the company's NanoTherm therapy.
Thin film solar printing leader Nanosolar, Inc. today announced that the U.S. Department of Energy's National Renewable Energy Laboratory (NREL) has certified an aperture efficiency of 17.1% for a solar cell fabricated using Nanosolar's non-vacuum, low cost printing on flexible foil technology.
ARM and UMC, a leading global semiconductor foundry, today announced a long-term agreement that provides UMC foundry customers with access to the latest advanced ARM Artisan Physical IP solutions validated on UMC's 28HPM process technology.
Proceeds from this financing will be used as to approximately $15,000,000 for the establishment of a full scale production facility for ultracapacitors and fundamental research center in the Russian Federation and as to approximately $5,000,000 for the expansion of Nesscap's current manufacturing and core R+D operations in Korea and for general corporate purposes.