With US government funding of nanotechnology receding slightly in 2011, Purchasing Power Parity (PPP) estimates indicate that for the first time, China will spend more than the US to fund nanotechnology.
Advanced Diamond Technologies (ADT), the world leader in developing diamond films for industrial, electronic, and water treatment applications announces the successful close of its $5.2 million Series D financing. S-Group Capital Management (S-Group) led this funding round, which also included a number of exising ADT investors.
CEA-Leti and Replisaurus Technologies, Inc., a developer of a metallization technology for integrated passives, copper pillars and 3D integration (TSV), today announced that they have completed a crucial step toward commercialization of Replisaurus' innovative ElectroChemical Pattern Replication (ECPRTM) metallization process.
SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, launched its new MaskTrack Pro InSync - the first holistic in-fab EUVL mask management offering.
Mitsubishi Chemical Holdings Corp will start making adhesive film used in solar cells, challenging Bridgestone Corp and Mitsui Chemicals Inc , who make the key material that determines the life span of the cells.
The scientific solutions provider issued calibration specifications for capacitance measurements that allow quantitative assessment of material and device properties via its award-winning Scanning Microwave Microscopy Mode.
United Solar, a wholly owned subsidiary of Energy Conversion Devices, Inc. (ECD) and a leading global manufacturer of light-weight, flexible thin-film solar modules, today announced that it has achieved a world record efficiency of 16.3% for thin-film silicon solar technology.
ASML Holding NV today announced three new extensions for its popular TWINSCAN NXT platform that improve imaging, overlay and productivity. The extensions enable chipmakers to manufacture smaller, faster chips more cost-effectively.
The Cadence Encounter-based flow and methodology were integrated to address the requirements of Samsung's advanced 20-nanometer process technology for the test chip. The flow handled IP integration and validation, as well as the complex design rules at 20 nanometers.