Ecology Coatings, Inc., a leader in the discovery and development of nanotechnology-enabled, ultraviolet-curable advanced coatings, today announced that it has added and upgraded testing and application development equipment in its Akron, Ohio-based laboratory, and has hired additional industry sales and product development personnel.
RoseStreet Labs, (RSL), announced today the world's first demonstration of a long wavelength LED device utilizing low cost silicon wafer substrates. Green and longer wavelength LEDs have been sought after by both science and industry for an extensive period of time because they would fill a high-value gap in the rapidly growing global LED market for lighting and illumination where energy efficiency, low cost and miniaturization are critical product characteristics.
Camtek Ltd. announced today that a leading Semiconductor Manufacturer has selected Xact, Camtek's Advanced Transmission Electron Microscope (TEM) sample preparation solution, enabling material analysis and verification.
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the semiconductor industry's first bonding system for 450-mm-diameter wafers manufactured from silicon-on-insulator (SOI) substrates.
A RUSNANO-cofinanced project to expand production of air purification systems that surpass current domestic and foreign competitors has gotten underway. The project has a total budget of 580 million rubles. RUSNANO will co-invest 261 million rubles in its realization.
Micralyne, Inc., a leading pure-play MEMS foundry serving high-performance biomedical, telecommunications and industrial markets, and A.M. Fitzgerald Associates, a MEMS product development firm, today announced a strategic partnership which will put customers on the fast-track path to commercialization.
Mitsubishi Heavy Industries, Ltd. (MHI) has developed a fully automated 8-inch wafer bonding machine that is capable of producing 3-dimensionally integrated LSI (large-scale integration) circuits at room temperature.
Advantest Corporation today announced the availability of two new solutions for next-generation NAND flash memory test: the T5773 for package test and the HA5100CELL, based on the Harmonic architecture, for wafer test. Together, the tools offer total test support for high-capacity, high-speed next-generation NAND flash memory devices, from the front end to the back end.
Picosun Oy, Finland-based global manufacturer of state-of-the-art Atomic Layer Deposition (ALD) equipment, reports successful process for preparation of gold thin films with plasma-enhanced ALD (PEALD) method first time in the world.
Augrid Global Holdings Corporation's subsidiary, Carbon Composite Technologies, will introduce a recently patented hybrid fiberglass/carbon nano textile fabric for use in the manufacturing of fiber reinforced polymer (FRP) products.
Batteries are the key technology for the electromobility of the future. Over the next five years, BASF will be investing a three-digit million euro sum in researching, developing and the production of battery materials.