Berkeley Design Automation Inc., provider of the Analog FastSPICE unified circuit verification platform today announced that Mohagi, a developer of energy-efficient analog and mixed-signal IP, has selected the company's Analog FastSPICE Nano SPICE simulator (AFS Nano) for analog and mixed-signal IP verification.
Anasys Instruments is pleased to announce that Dr William P King has been appointed as the Bliss Professor of Engineering at the University of Illinois at Urbana-Champaign. In addition to his faculty position at UIUC, Dr. King serves as a key scientific advisor to Anasys Instruments.
Atrenta Inc., a leading provider of SoC Realization solutions for the semiconductor and electronic systems industries, in collaboration with imec's 3D integration IIAP (industrial affiliation program), have jointly developed an advanced planning and partitioning design flow for heterogeneous 3D stacked ICs. Imec and Atrenta will be demonstrating this flow at the Design Automation Conference (DAC) in San Diego, CA from June 6-8, 2011.
Last month, the California NanoSystems Institute (CNSI) at UCLA - one of the major nanotechnology institutes in the United States - was the host of a two-day, AFM-Raman and TERS workshop given by Nanonics Imaging Ltd. and Renishaw, market leaders in AFM-Raman systems.
mPhase Technologies, Inc. reported today that it has been granted a United States patent for the unique concept of a smart battery design that could contain different battery chemistries within the same battery configuration or battery pack.
SEMATECH, a global consortium of chipmakers, announced today that FUJIFILM Electronic Materials, a leading global supplier of photoresists, developers, cleaners and removers, polyimides and thin film chemicals and equipment for the semiconductor industry, has joined SEMATECH's Resist Materials and Development Center (RMDC) at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany.
Solar3D, Inc., the developer of a breakthrough 3-dimensional solar cell technology to maximize the conversion of sunlight into electricity, announced today that its technology development is ahead of schedule.
3M, through its New Ventures Business, has invested in GoNano Technologies Inc., a developer and manufacturer of high surface area nanomaterials for pollution control, catalysis, composites and sensory technologies headquartered in Moscow, Idaho.
Olympus has introduced FV10-ASW 3.0, the latest version of its software for the FluoView FV1000 range of confocal laser scanning microscopes (cLSM) and Fluoview FV1000MPE (multiphoton excitation) systems.
Under the terms of the agreement, Crocus and RUSNANO will form Crocus Nano Electronics (CNE), to build an advanced MRAM facility in Russia, capable of manufacturing medium to high density MRAM products based on Crocus' Thermally Assisted Switching (TAS) MRAM technology at 90nm and 65nm lithographies.