AIXTRON SE today announced a new MOCVD reactor order from existing customer Ubilux of Tainan County, Taiwan. The order is for two AIXTRON CRIUS II deposition systems in the 55x2-inch configuration which will be used to expand the company's production capacity for GaN-based HB LEDs.
GaN based epitaxy on silicon (Si) is very challenging because of the thermal mismatch between GaN and Si, which causes extreme tensile stress after cooling. For such applications LayTec's EpiCurveTT is the tool of choice for a precise in-situ strain engineering.
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the development of 1 gigabit (Gb) mobile DRAM with a wide I/O interface, using 50 nanometer class process technology. The new wide I/O mobile DRAM will be used in mobile applications, such as smartphones and tablet PCs.
MEMSCAP, the leading provider of innovative solutions based on MEMS (micro-electro-mechanical systems) technology, including optical components, today announces it has successfully completed die level reliability testing beyond 200 millions cycles on its Thermally Actuated Variable Optical Attenuators.
WATT Fuel Cell Corp., a designer and developer of solid oxide fuel cell (SOFC) systems, announces an agreement granting the company an exclusive worldwide license to fuel cell technology intellectual property previously developed and implemented at NanoDynamics Energy Inc.
rIQ is designed to determine the refractive index of glass quickly, accurately and easily. A vital instrument for any forensic laboratory, rIQ is offered in a standalone configuration, as part of a microspectrophotometer which includes color analysis of glass, or as an upgrade package.
Picosun Oy, Finland-based global manufacturer of state-of-the-art Atomic Layer Deposition (ALD) systems, joined forces with other high profile Finnish high-tech companies to boost India's emerging clean technology markets with world-leading know-how on issues such as wind power, water management and nanotechnology solutions for green and sustainable development at the Delhi Sustainable Development Summit (DSDS) February 3rd - 5th, Delhi, India 2011.
C3Nano, Inc. this week announced that the company has closed a US $3.2 million round of Series-A financing from China and Silicon Valley-based GSR Ventures. A spinout company from Professor Zhenan Bao's chemical engineering lab at Stanford University, C3Nano has developed a sustainable, proprietary hybrid carbon nanotube (CNT) based transparent electrode ink and film for use in devices such as touch screens, OLED devices, photovoltaic solar panels and flexible displays.
The new Arizona factory, designated Fab 42, will be the most advanced, high-volume semiconductor manufacturing facility in the world. Construction of the new fab is expected to begin in the middle of this year and is expected to be completed in 2013.
LayTec AG announces its conversion from LayTec GmbH (a limited liability company) into LayTec AG (Aktiengesellschaft, joint stock corporation). With today's entry into the commercial register of Berlin/Charlottenburg, LayTec will operate in future as LayTec AG.
The Max Planck Institute for Polymer Research (MPI-P) and Asylum Research, the technology leader in scanning probe/atomic force microscopy (SPM/AFM), are co-organizing the 2nd International Workshop for Scanning Probe Microscopy for Energy Applications, to be held at the MPI-P in Mainz, Germany from June 8-10, 2011.
Cascade Microtech, Inc. today announced that its VueTrack probe-to-pad alignment solution and its S-Technology Pyramid production test probe cards have been selected by the editors of Test and Measurement World as finalists for "Best in Test" products in the category of Wafer Probing.