Energetiq Technology, Inc., a developer and manufacturer of ultrahigh-brightness light sources for advanced technology applications, has appointed Elliot Scientific Ltd. as its distributor in the United Kingdom and Ireland for Energetiq's range of Laser-Driven Light Source (LDLS) products.
Ener1, Inc., a leader in lithium-ion battery technology, and Wanxiang Electric Vehicle Co., Ltd., a division of the Chinese conglomerate Wanxiang Group Corporation, today signed a joint venture agreement to co-manufacture Li-ion cells and battery packs for the rapidly growing Chinese market.
Docea Power, the design-for-low-power company that delivers software for power and thermal analysis at the architectural level (ESL), announced today that its Aceplorer software has been selected by the University of Tokyo to model and optimize power consumption for new non-volatile memory (NVM) designs and architectures as part of a Japanese national research project.
NanoInk's NLP 2000 System is a desktop nanofabrication system that allows researchers to rapidly design and create custom engineered and functionalized surfaces on the micro and nanoscale, using Dip Pen Nanolithography to transfer minute amounts of materials over a large, environmentally controlled work area.
Russian Corporation of Nanotechnologies (RUSNANO) and Plastic Logic today announced they have finalized details of RUSNANO's investment in the company, which is the global leader in the emerging field of plastic electronics.
Arrowhead Research Corporation today announced that it has invested $1 million in its majority owned subsidiary, Calando Pharmaceuticals, and converted approximately $8M of Calando debt to Arrowhead into equity. Arrowhead now owns approximately 79% of Calando's outstanding equity.
The resulting technology will provide a suite of optimized physical and processor IP by ARM tuned to IBM's advance manufacturing process down to 14nm; providing streamlined development and earlier introduction of advanced consumer electronics into the marketplace.
NetLogic Microsystems, Inc., a worldwide leader in high-performance intelligent semiconductor solutions for next-generation Internet networks, today announced that it has developed and taped out its next-generation silicon in the advanced 28nm process at Taiwan Semiconductor Manufacturing Company.
CEA-Leti, a recognized leader in 3D integration R+D, will significantly expand its technology offering this month when it ramps up one of Europe's first 300mm lines dedicated to 3D-integration applications.
SouthWest NanoTechnologies, Inc. is introducing its family of conductive and semi-conductive CNT inks for flexible printed electronics and displays at the FlexTech Alliance 2011 Flexible Electronics and Displays Conference and Exhibition.