Diamon-Fusion International, Inc., global developer and exclusive licensor of patented hydrophobic nanotechnologies, announced today the company along with its partner, New York Poly Steel, has secured a bid for a large-scale coating project for the original Tiffany and Co. building at 15 Union Square Street in New York City.
NanoLogix, Inc. announces its new Quick-Test product line for detection and identification of aerobic live-cell bacteria. With the NanoLogix Quick-Tests, the research community will be able to obtain high-sensitivity analysis results in reduced time with lower costs than traditional technologies.
Veeco Instruments Inc. announced today it has been selected by leading global hard disk drive manufacturers for critical technology that enables higher areal density for next generation thin film magnetic heads.
AMO GmbH, a private research service provider in the field of nanofabrication, and SUSS MicroTec AG, a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets, are working on the development of applications for SCIL (Substrate Conformal Imprint Lithography) with UV curing material.
GLOBALFOUNDRIES today announced a strategic partnership with SVTC Technologies to accelerate the move to high-volume manufacturing of Microelectromechanical Systems (MEMS). The collaboration, which will focus on joint technology development, will help GLOBALFOUNDRIES achieve its goal of becoming a MEMS foundry leader.
The Singapore Institute of Manufacturing Technology (SIMTech), a research institute of the Agency for Science, Technology and Research (A*STAR), today launch the Nanotechnology in Manufacturing Initiative (NiMI). Supported by International Enterprise(IE) Singapore, Singapore Economic Development Board (EDB) and SPRING Singapore, this initiative explores nanomaterials for industry applications and addresses challenges in the adoption of nanotechnology for manufacturing.
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today the industry's first production of a 3-bit-cell (3bit), 64 gigabit (Gb) NAND flash using 20 nanometer-class process technology. The highly advanced new chip can be used in high-density flash solutions such as USB flash drives (UFDs) and Secure Digital (SD) memory cards.
GLOBALFOUNDRIES today introduced three newly certified design services companies as part of its GLOBALSOLUTIONS partner ecosystem. Infotech Enterprises Limited, Verisilicon, and Wipro Limited have joined GLOBALSOLUTIONS, further strengthening the company's ability to help customers accelerate time-to-volume for complex systems-on-chip (SoCs) on advanced technology nodes.
Carl Zeiss introduces the Axio Lab.A1 microscope for examinations in reflected light in the materials sciences. It's particularly intuitive operation makes this upright microscope suitable for routine lab applications in metallography, quality control and for inspection tasks in production lines.
Alchimer S.A., a provider of nanometric deposition technology for through-silicon vias (TSVs), semiconductor interconnects and other electronic applications, is extending its presence in Japan under terms of a new agreement with the Nagase ChemteX unit of Tokyo-based Nagase and Co., Ltd.
In a well attended three-day meeting more than 120 small molecule and structural biology users had the opportunity to exchange ideas and their experience with Bruker diffraction instrumentation and meet with people of the Bruker Single Crystal Diffraction team.
The Silicon Integration Initiative (Si2) announced today that Tanner EDA, Inc., a driver for innovation in the design, layout and verification of analog and mixed-signal integrated circuits (ICs), has recently joined Si2. Tanner joins the other 100 key players in the semiconductor supply chain, focused on the development and adoption of standards to improve the way integrated circuits are designed and manufactured.
AIXTRON AG today announced that in the second quarter of 2010, Formosa Epitaxy Inc. (FOREPI), placed an order for a 56x2-inch AIX G5 HT MOCVD reactor which will be used for ultra-high brightness (UHB) GaN-based LEDs.