Toshiba Corporation today announced that it has developed a breakthrough technology for a nanowire transistor, a major candidate for a 3D structure transistor for system LSI in the 16nm generation and beyond.
Cambridge NanoTech, a world leader in Atomic Layer Deposition (ALD) science and equipment, today announced that they have partnered with Stanford University's Center for Integrated Systems (CIS), a partnership between academia and industry that supports leading edge research into semiconductor and advanced electronics.
SouthWest NanoTechnologies, Inc., a leader in high quality, single-wall and specialty multi-wall carbon nanotubes, will be exhibiting and presenting a paper at the Nano Science and Technology Institute (NSTI) Nanotech Conference and Expo 2010 June 21-24.
EdXact, post-layout verification specialist today announced that its netlist reduction software Jivaro has been included in TSMC's Analog/Mixed-Signal (AMS) Reference Flow for 28nm analog and mixed-signal circuit design.
mPhase Technologies, Inc. reported today that it has been granted a United States patent for the concept of a porous membrane made from silicon that is capable of controlling the flow of a wide range of liquids, including electrolytes, used in both primary and rechargeable batteries.
The needs of society are driving the nano revolution, with applications springing up anywhere they will have societal benefit. The latest issue of NANO Magazine looks at a number of these benefits in different sectors, including the automotive industry, transport, medicine, food, textiles and inket devices.
SEMATECH today announced that Sitaram Arkalgud, director of 3D interconnect program at SEMATECH, will speak to leading technologists and electronics design suppliers attending the 47th Design Automation Conference.
Over 4,000 engineers, scientists and industry professionals from around the world gathered at the Donald E. Stephens Convention Center in Rosemont, IL last week for the Sensors Expo and Conference, the leading event in North America focused exclusively on sensors and sensor-integrated systems.
Under the terms of the common laboratory agreement, CEA-Leti will use EDA tools provided by Docea Power to build 3D-IC designs and methodologies for developing advanced applications consumer and wireless.
This joint development is set to establish a 3D IC research and development line at IME's facility in Singapore using EVG's wafer bonding, alignment and lithography systems for 200- and 300-mm through silicon via (TSV) process development.
Beneq, leading provider of new industrial equipment and technology based on atomic layer deposition (ALD) equipment, and ALD NanoSolutions, renowned developer of ALD processes and applications, have today signed a letter of intent for future collaboration.
The article addresses the formulation and application of silane-based coatings used for preserving and protecting glass and anti-reflective coatings to maintain the lifetime and functionality of lenses, windows and display screens.
The beneficial effects of nanotechnology innovation on human health and the environment are the focus of a report to be presented at the Nano Science and Technology Institute's Nanotech Conference and Expo 2010 in Anaheim, CA, June 21-24, 2010.
DEK Solar Senior Process Development Specialist, Tom Falcon, recently presented the company's latest advances in print-on-print (PoP) technology to assembled delegates at a metallization workshop organized by the Energy research Centre of the Netherlands (ECN).