Leveraging patented Dip Pen Nanolithography technology, NanoInk has demonstrated the successful use of its NLP 2000 System for functionalizing biosensors, patterning functional hydrogels, and printing multiplexed protein arrays.
Microfluidics International Corporation today announced that, along with its exclusive Japanese distributor, POWREX Corporation, it has introduced Microfluidics Reaction Technology (MRT) to Japan as the world's only viable large-scale, bottom-up technology for nanoparticle creation.
Offering up to 1.6 Tbps of serial switching capability, Stratix V FPGAs leverage a myriad of new technologies and a leading-edge 28-nm process to reduce the cost and power of high-bandwidth applications.
Taiwan Semiconductor Manufacturing Company, Ltd. today announced that it has shipped nearly 600,000 8-inch 0.25-micron AEC-Q100 grade 1 qualified embedded flash (EmbFlash) wafers targeted at a wide variety of automotive applications.
Malvern is to receive the 2010 Queen's Award for Enterprise in the category Innovation, in recognition of the company's continuous innovation and development of its award winning Zetasizer Nano range of particle characterization systems.
Oxford Instruments NanoScience has been awarded The Queen's Award for Enterprise: Innovation for the development of Triton200, a cryogen-free dilution refrigerator with an integrated high-field superconducting magnet.
mPhase Technologies, Inc., the developer of Power On Command battery technologies, will be announcing this afternoon that it has successfully bonded a glass reservoir capable of holding various electrolytes to the microfluidic structured layer of the mPhase Smart NanoBattery - a key step in the packaging and assembly phases of this innovative new power source.
Anatoly Chubais, RUSNANO CEO and Shaoping Lu, Managing Director of Thunder Sky Group Limited (China) signed the agreement today in Beijing to establish the first Russian production of ultra-capacity lithium-ion batteries.
Tegal Corporation, an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices, announced today it has appointed veonis Technologies GmbH, Puchheim, Germany, as its agent for silicon DRIE and dielectric DRIE products in Germany.
Lam Research Corporation, a major supplier of semiconductor wafer fabrication equipment and services, today announced it has shipped the 3,000th single-wafer SEZ spin clean technology process module to a leading DRAM manufacturer.
Presto Engineering Inc., a pioneer of the labless business model for bringing semiconductor products into volume production, and CEA-Leti today announced that they have begun a three-year collaboration to develop test and analysis capability for 3D semiconductor devices.