BioNanomatrix, Inc., a developer of breakthrough single-molecule genomic analysis technology, today announced the issuance of U.S. patent 7,670,770 for nanochannel arrays that enable high-throughput macromolecular analysis. Also disclosed are methods of preparing nanochannel array chips, methods of analyzing macromolecules such as entire strands of genomic DNA, and systems for implementing these methods.
Thermacore, Inc., announced today that Thermacore Europe is making tremendous progress as lead partner of an 8.3 million euro European research project, NanoHex. The team is tasked with developing a next-generation liquid coolant that incorporates purpose engineered nanoparticles for more efficient cooling.
Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that the Galaxy Implementation Platform has helped Infineon Technologies AG achieve first-pass silicon success of the 40-nanometer baseband processor for its X-GOLD 626 3G wireless analog and digital system-in-package.
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Morocco-based wafer-level camera manufacturer Nemotek Technologie has placed a repeat order for EVG's bonding and UV nanoimprint lithography (UV-NIL) systems - the EVG520IS and IQ Aligner.
The World biggest semiconductor foundry from Taiwan has placed a combined order for the Mask Defect Repair System MeRiT HR 32 and the Aerial Image Measurement System AIMS 32-193i from Carl Zeiss to prepare for the production of next generation high-end photomasks.
Thermo Fisher Scientific Inc., the world leader in serving science, today introduced the new Thermo Scientific Multiskan GO UV-Vis spectrophotometer offering free wavelength selection for both 96- and 384-well plates and various types of cuvettes.
Applied Materials, Inc. today announced the semiconductor industry's first integrated low temperature pre-clean for epitaxial (epi) applications which is available on its market-leading Applied Centura RP Epi system.
Applied Materials, Inc. today unveiled its Applied UVision 4 wafer inspection system, enabling chipmakers to detect yield-limiting defects in the critical patterning layers of 22nm and below logic and memory devices.