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LayTec Introduces Solution for Measuring Exact Surface Temperature of GaN Layers

At the International Conference on Nitride Semiconductors (ICNS) in Korea on 18-23 October LayTec presented its latest product: Pyro 400. Unlike conventional infrared pyrometry, which can only detect the susceptor surface temperature under sapphire or SiC wafers, Pyro 400 is the first real solution for measuring the exact surface temperature of GaN layers.

Posted: Nov 12th, 2009

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SEMATECH Symposia Reveal Continuing Momentum in EUVL and 193 nm Immersion Extensions

SEMATECH engineers and the industry at large continue to make progress in developing the infrastructure that will enable lithography for cost-effective manufacturing, according to papers presented at the 2009 International EUVL (Extreme Ultraviolet Lithography) and 193 nm Immersion Extensions Symposia, held Oct. 18-23, in Prague, Czech Republic.

Posted: Nov 12th, 2009

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Rudolph's Automated Data Analysis Software Improves Yield in MEMS Inspection

Rudolph Technologies, Inc., a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, announced today that Touch Micro-System Tech, a major manufacturer of micro-electro-mechanical systems (MEMS) located in Taiwan, has reported a substantial reduction in per-wafer inspection time using Rudolph's NSX Inspection System and Discover Data Analysis software.

Posted: Nov 9th, 2009

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