Rudolph Technologies, Inc., a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, announced today that Touch Micro-System Tech, a major manufacturer of micro-electro-mechanical systems (MEMS) located in Taiwan, has reported a substantial reduction in per-wafer inspection time using Rudolph's NSX Inspection System and Discover Data Analysis software.
Diamon-Fusion International, Inc., global developer and exclusive licensor of patented hydrophobic nanotechnologies, announced today the signing of another key strategic alliance and license agreement in Hong Kong with Decorlinks Ltd.
Applied Materials, Inc., the leading supplier of equipment and services to the solar photovoltaic (PV) industry, announced today that it has acquired substantially all the assets, including the intellectual property, of Advent Solar, Inc. for an undisclosed cash amount.
Automotive lithium-ion battery maker EnerDel, Inc. announced today that it will be working with the United States Army to develop a next-generation battery system for the hybrid version of the High Mobility Multipurpose Wheeled Vehicle (HMMWV or Humvee), known as the XM1124 Humvee.
BASF is realigning its business for the fuel cell market. In the future, competencies for the production of high-temperature membrane electrode assemblies (MEAs) will be concentrated in Somerset, New Jersey.
HP today announced new inertial sensing technology that enables the development of digital micro-electro-mechanical systems (MEMS) accelerometers that are up to 1,000 times more sensitive than high-volume products currently available.
Cambrios Technologies Corporation, an electronic materials company commercializing ClearOhm coating material for producing transparent conductive films, announced today that the company has received investments totaling $14.5 million in a first closing of its Series D Financing Round.
Infineon Technologies AG and Taiwan Semiconductor Manufacturing Company announced that they are extending their development and production partnership to a 65nanometer embedded flash process technology targeting next generation automotive, chip card and security applications.