CopyTele, Inc. announced today that it has entered into an Engagement Agreement with ZQX Advisors, LLC to seek business opportunities and licenses for its electrophoretic display technology (E-paper) and its related intellectual property, particularly its patent portfolio.
Applied Ventures, LLC, the venture capital arm of U.S.-based Applied Materials, Inc., invests in Tera Barrier Films Pte. Ltd., a newly incorporated spin-off from A*STAR's Institute of Materials Research and Engineering.
Following oversubscription of Nano Bridging Molecules SA's first funding round in 2007 NBM significantly expanded its pre-clinical testing program, embarked on its first dental human clinical trial, recruited key scientific and clinical research staff and relocated its operations to purpose built laboratories and new offices in the Swiss canton of Vaud.
PerkinElmer, Inc. announced that it has entered into an exclusive agreement with Max Planck Innovation, the technology transfer organization of the Max Planck Society, for the licensing of its ultra-fast, low cross-talk solid state silicon photomultiplier (SiPM) technology.
This business development advisory committee will be headed by Director Paul Rocheleau and will also include board member Clint Everton and members of management. The committee intends to add other qualified outsiders in the near future.
Nanotherapeutics, Inc. today announced that it has been awarded a $30.9 Million, 5-year contract from the National Institute of Allergy and Infectious Diseases (NIAID), part of the National Institutes of Health (NIH), to develop an inhaled version of the injectable antiviral drug, cidofovir, for non-invasive, post-exposure prophylaxis and treatment of the Category A bioterrorism agent smallpox.
Nanocyl announced today it will showcase the performance and cost-competitive benefits of its CNTs for cutting-edge conductive plastic applications at Nano Korea 2009, from August 26-28, in Ilsan, Gyeonggi-do, Korea.
Taiwan Semiconductor Manufacturing Company, Ltd. today announced that it is adding a low power process to its 28nm high-k metal gate (HKMG) road map. The new process is expected to enter risk production in the third quarter of 2010.
Designed for Semiconductor plating applications where single sided copper electroplating of large areas is required, Semiplate Cu is a high speed copper plating process capable of depositing copper at 40 - 60 ASF with virtually no internal stress in the deposit.