Malvern Instruments has published work demonstrating how the Sysmex FPIA-3000 image analysis-based particle characterization system provides a reference method for validating particle size measurements of the porous silica materials used in high performance liquid chromatography (HPLC) columns.
ASM International N.V. today announced that it has sold its Pulsar Atomic Layer Deposition (ALD) system for high-k gates to two top Japanese logic device manufacturers for insertion in the 32/28nm technology node.
Virage Logic Corporation today announced it has extended its advanced IP technology leadership to the 32/28-nanometer process node with the tape out of a product test chip with multiple IPs optimized for a high performance application for an early adopter customer.
Third-generation ICP source improves DRIE productivity and yield for MEMS and 3D IC market applications; worldwide ProNova User Group accelerates DRIE learning cycles with multi-site process demonstration capabilities.
One of the world's leading suppliers of semiconductor solutions, ST will partner with GLOBALFOUNDRIES to produce products based on 40nm Low Power (LP) bulk silicon technology. The 40nm LP process is ideal for the next generation of wireless applications, handheld devices, and consumer electronics, which require excellent performance and long battery life.
Project plans include development of two vaccines for human flu and bird flu and three biopharmaceuticals for treatment of cancer-related toxicity, boosting of the immune system and increasing the efficiency of antibacterial and antiviral drugs, and treatment of lower extremity ischemia and motor neuron disease.
Cerulean intends to use the proceeds from the financing to advance the clinical development of IT-101, a cyclodextrin-based camptothecin nanoparticle recently in-licensed from Calando Pharmaceuticals, Inc., and to accelerate the preclinical development of nanoparticle-based drugs using both Cerulean's pre-existing nanoparticle-based technology as well as the in-licensed cyclodextrin-based nanoparticle technology.
The Buffalo News reports that Buffalo, NY based NanoDynamics, once lauded for its high-tech job growth potential, is now headed for liquidation. On Monday, the company filed for Chapter 7 bankruptcy, about a week after ceasing operations.
Nextreme Thermal Solutions, a leader in microscale thermal and power management products for the electronics industry, and Lockheed Martin have entered into a cooperation agreement to develop new products based on Nextreme's thin-film thermoelectric materials.
Freescale Semiconductor has successfully taped out a 45-nanometer networking design using the Cadence 'correct-by-design' prevention, analysis, implementation and signoff solution for faster, more predictable time-to-volume production.