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New AFP-200 From Ambios Combines Benefits of Stylus-Optical and AFM Profiling

Ambios Technology, Inc. introduced its newest instrument for characterization of surface morphology at the nanoscale. The new AFP-200 is a unique high-resolution surface measurement and analysis system that combines the ease of use of a stylus and optical profiler with the precision and resolution of a scanning probe microscope.

Posted: Jul 15th, 2009

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ISSYS Licenses Microtube Patent to Affinity Biosensors

Affinity Biosensors is developing and commercializing methods of measuring and monitoring particles, cells, bacteria, and viruses using resonating micromachined tubes. The licensing agreement allows Affinity Biosensors to use ISSYS' microtube fabrication technology to develop more advanced versions of their unique particulate sensors.

Posted: Jul 14th, 2009

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sp3 Diamond Technologies Launches Tunable Diamond Coatings for Wear Surfaces

sp3 Diamond Technologies, Inc., a leading supplier of diamond film products, equipment and services, today announced that its chemical vapor deposition (CVD) deposition capability has been expanded to provide diamond coatings ranging from super smooth nanocrystalline with a surface roughness of less than 10 nm to controlled microcrystalline films with a surface roughness greater than 10 Ám.

Posted: Jul 14th, 2009

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Research Collaboration to Further Develop Use of Micro-Nano Silicon

American Nano Silicon Technologies, Inc., a leading manufacturer and distributor of Micro-Nano Silicon, announced today that the Company has entered into a cooperative research and development agreement with Southwest University of Science and Technology, School of Materials Science and Engineering, to improve and further develop the potential usage of Micro-Nano Silicon in various industrial fields.

Posted: Jul 14th, 2009

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Applied Materials Sees Innovation and Industry Collaboration as Vital to Keeping Moore's Law Alive

While the current economic environment is imposing severe constraints on the semiconductor equipment industry, the primary driver for increasing profitability for leading-edge chipmakers is still Moore?s Law. However, moving to the next technology node will require even higher levels of R&D investment to overcome key technical barriers. The semiconductor equipment industry must find ways to make today's reduced R&D budgets meet these challenges.

Posted: Jul 14th, 2009

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Breakthrough Technology to Bridge Gap Between Inexpensive Thin-Film and Higher Efficiency Silicon Wafer Solar Technologies

XsunX, Inc., an established solar company, today announced that it is developing a breakthrough thin-film photovoltaic (TFPV) cross-industry technology that may soon utilize the excess manufacturing capacity of the mature hard disc drive (HDD) industry to mass produce high efficiency, low cost solar cells to truly capture the power of the sun.

Posted: Jul 14th, 2009

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