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ISSYS Licenses Microtube Patent to Affinity Biosensors

Affinity Biosensors is developing and commercializing methods of measuring and monitoring particles, cells, bacteria, and viruses using resonating micromachined tubes. The licensing agreement allows Affinity Biosensors to use ISSYS' microtube fabrication technology to develop more advanced versions of their unique particulate sensors.

Posted: Jul 14th, 2009

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sp3 Diamond Technologies Launches Tunable Diamond Coatings for Wear Surfaces

sp3 Diamond Technologies, Inc., a leading supplier of diamond film products, equipment and services, today announced that its chemical vapor deposition (CVD) deposition capability has been expanded to provide diamond coatings ranging from super smooth nanocrystalline with a surface roughness of less than 10 nm to controlled microcrystalline films with a surface roughness greater than 10 Ám.

Posted: Jul 14th, 2009

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Research Collaboration to Further Develop Use of Micro-Nano Silicon

American Nano Silicon Technologies, Inc., a leading manufacturer and distributor of Micro-Nano Silicon, announced today that the Company has entered into a cooperative research and development agreement with Southwest University of Science and Technology, School of Materials Science and Engineering, to improve and further develop the potential usage of Micro-Nano Silicon in various industrial fields.

Posted: Jul 14th, 2009

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Applied Materials Sees Innovation and Industry Collaboration as Vital to Keeping Moore's Law Alive

While the current economic environment is imposing severe constraints on the semiconductor equipment industry, the primary driver for increasing profitability for leading-edge chipmakers is still Moore?s Law. However, moving to the next technology node will require even higher levels of R&D investment to overcome key technical barriers. The semiconductor equipment industry must find ways to make today's reduced R&D budgets meet these challenges.

Posted: Jul 14th, 2009

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Breakthrough Technology to Bridge Gap Between Inexpensive Thin-Film and Higher Efficiency Silicon Wafer Solar Technologies

XsunX, Inc., an established solar company, today announced that it is developing a breakthrough thin-film photovoltaic (TFPV) cross-industry technology that may soon utilize the excess manufacturing capacity of the mature hard disc drive (HDD) industry to mass produce high efficiency, low cost solar cells to truly capture the power of the sun.

Posted: Jul 14th, 2009

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New MaskTrack Pro System Delivers Technology for Next Generation Lithography

HamaTech Advanced Process Equipment today announced its most advanced photomask processing system, the MaskTrack Pro, which extends the technology of HamaTech's highly successful MaskTrack System to Next Generation Lithography applications: 193i 22nm half pitch, Extreme Ultraviolet Lithography and Nano-Imprint Lithograph.

Posted: Jul 14th, 2009

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Soitec and IBM to Pioneer 22-Nanometer Node Wafer Techniques

The Soitec Group announced today that it has entered into collaboration with IBM to pioneer 22-nanometer node and beyond silicon wafer substrate and bonding techniques that will enable wafer-level, three-dimensional integration technology for next-generation integrated circuits.

Posted: Jul 14th, 2009

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