mPhase Technologies, Inc. today released a video demonstrating that a liquid electrolyte can be controlled atop a man made surface. This key process allows the activation of the Smart NanoBattery to be controlled.
Electro Scientific Industries, Inc., a leading provider of world-class photonic systems for microengineering, today announced that it has bolstered its technology offerings for both its 3D IC packaging and memory repair product applications.
Nanometrics Incorporated, a leading supplier of advanced process control metrology systems used primarily in the manufacturing of semiconductors, solar photovoltaics and high-brightness LEDs, today announced the delivery of a Unifire metrology system equipped with the Advanced Film Capability option.
Affinity Biosensors is developing and commercializing methods of measuring and monitoring particles, cells, bacteria, and viruses using resonating micromachined tubes. The licensing agreement allows Affinity Biosensors to use ISSYS' microtube fabrication technology to develop more advanced versions of their unique particulate sensors.
sp3 Diamond Technologies, Inc., a leading supplier of diamond film products, equipment and services, today announced that its chemical vapor deposition (CVD) deposition capability has been expanded to provide diamond coatings ranging from super smooth nanocrystalline with a surface roughness of less than 10 nm to controlled microcrystalline films with a surface roughness greater than 10 Ám.
American Nano Silicon Technologies, Inc., a leading manufacturer and distributor of Micro-Nano Silicon, announced today that the Company has entered into a cooperative research and development agreement with Southwest University of Science and Technology, School of Materials Science and Engineering, to improve and further develop the potential usage of Micro-Nano Silicon in various industrial fields.
SUSS MicroTec, a leading supplier of process and test solutions for the semiconductor and related industries, and the Belgian nanoelectronics research center IMEC have entered a joint development program.
While the current economic environment is imposing severe constraints on the semiconductor equipment industry, the primary driver for increasing profitability for leading-edge chipmakers is still Moore?s Law. However, moving to the next technology node will require even higher levels of R&D investment to overcome key technical barriers. The semiconductor equipment industry must find ways to make today's reduced R&D budgets meet these challenges.
XsunX, Inc., an established solar company, today announced that it is developing a breakthrough thin-film photovoltaic (TFPV) cross-industry technology that may soon utilize the excess manufacturing capacity of the mature hard disc drive (HDD) industry to mass produce high efficiency, low cost solar cells to truly capture the power of the sun.
HamaTech Advanced Process Equipment today announced its most advanced photomask processing system, the MaskTrack Pro, which extends the technology of HamaTech's highly successful MaskTrack System to Next Generation Lithography applications: 193i 22nm half pitch, Extreme Ultraviolet Lithography and Nano-Imprint Lithograph.
The Soitec Group announced today that it has entered into collaboration with IBM to pioneer 22-nanometer node and beyond silicon wafer substrate and bonding techniques that will enable wafer-level, three-dimensional integration technology for next-generation integrated circuits.
LDK Solar Co., Ltd., a leading manufacturer of multicrystalline solar wafers, today announced the acquisition of a controlling interest of Solar Green Technology S.p.A., an expert system integrator in the Italian market.