As Americans prepare to enjoy the longest day of the year on Sunday, June 21 during the summer solstice, Applied Materials, a leading supplier of solar manufacturing equipment, has released a survey reflecting the general public?s understanding and opinions about solar energy.
For the study of devices and materials such as energy-efficient light emitting diodes and fuel cells, and processes such as artificial photosynthesis, aberration-corrected (scanning) transmission electron microscopy (S/TEM) allows individual atoms to be observed and chemically identified.
An imaging agent used during PET scans to highlight apoptosis (programmed cell death) appears to help oncologists detect the effect of radiation treatment on brain metastases (tumors from elsewhere in the body that have spread to the brain) early in treatment, according to new data presented today at the 56th Annual Meeting of the Society of Nuclear Medicine.
Integrated Sensing Systems, Inc. (ISSYS) in Ann Arbor, Michigan and Endress+Hauser Flowtec AG in Switzerland have announced that they have entered into a strategic partnership. The objective of this partnership is to collaboratively develop and commercialize advanced sensing fluidic products based on ISSYS' cutting-edge MEMS (Micro-Electro-Mechanical-Systems) technology.
GLOBALFOUNDRIES today described an innovative technology that could overcome one of the key hurdles to advancing high-k metal gate (HKMG) transistors, bringing the industry one step closer to the next generation of mobile devices with more computing power and vastly improved battery life.
Fluidigm is introducing its new 1.96 Diffraction Capable (DC) integrated fluidic circuit which will allow researchers something they have long sought - direct screen-to-beam capabilities without the need to physically harvest a crystal from the device.
Nanocomp Technologies, Inc., a developer of energy saving performance materials and component products from carbon nanotubes (CNTs), today announced it has produced and delivered 10 kilometers of its CTex CNT yarn to one of its Fortune 100 aerospace customers.
DKSH Holding Ltd. and Oerlikon Systems today announced that the companies have reached an agreement that DKSH will take over all sales and after-sales activities of Oerlikon Systems in China and Taiwan.
The Soitec Group, a leading supplier of engineered substrates for the microelectronics industry, announced today that its 300mm ultra-thin SOI (UTSOI) wafer platform is qualified and ready to support fully depleted (FD) device applications scheduled on the industry's CMOS roadmaps for 22nm and beyond.