Cymbet Corporation today announced that it has been honored with a Sensors' "Best of Sensors Expo 2009" bronze award. Cymbet won this award for its EnerChip EH CBC5300 energy harvesting module which is a key enabler for autonomous wireless sensor networks.
Nanometrics Incorporated, a leading supplier of advanced process control metrology systems used primarily in the manufacturing of semiconductors, solar photovoltaics and high-brightness LEDs, today announced a follow-on order for an Atlas metrology system equipped with NanoCD capability.
JPK Instruments, a world-leading manufacturer of nanoanalytic instrumentation for research in life sciences and soft matter, is pleased to announce the installation of its unique NanoTracker optical tweezers system in the laboratory of Dr. Remus Dame at Leiden University.
Innovative Silicon, Inc., developer of the Z-RAM zero-capacitor floating body memory technology, and Hynix Semiconductor Inc. announced today that Hynix will deliver a paper titled 'Highly scalable Z-RAM with remarkably long data retention for DRAM application' at the 2009 Symposium on VLSI Technology.
Researchers from Abo Akademi University and the University of Turku in Finland have discovered that the stability of functionalised nanoparticles is crucially dependent on all functional groups present on the surface.
OrthoMEMS, a medical device company focused on biomedical applications of patented MEMS and wireless technology, today announced that it has been granted an exclusive option from Cleveland Clinic to expand its license to include all fields of use.
QD Vision, developer of nanotechnology-based products for lighting and displays, today announced it has been awarded a Small Business Innovation Research (SBIR) Phase II contract by the U.S. Army as part of its Night Vision and Electronic Sensors Directorate.
Luxtera, a provider of Silicon CMOS Photonics, announced its collaboration with Freescale Semiconductor as its foundry source to achieve production of the world's first commercial Silicon CMOS Photonics semiconductor manufacturing process.
EV Group, a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has launched an all-new EVG501 wafer bonding system to address rising cost burdens for its university and R+D customers.