Sensitive electro-optical imaging and target-acquisition systems will achieve new levels of range and sensitivity performance thanks to a UK company's breakthrough in developing a 'super black' material to be launched at the Farnborough International Air Show.
Park NX-Wafer produces sub-Angstrom roughness measurements for the flattest substrates and wafers with tip-to-tip variation of less than 2%, for the first time ever in the entire history of the semiconductor industry. This fully automated defect review and identification system enables a critical inline process to classify defect types and source their origin through high resolution 3D imaging only available at Park Systems, the world's leading AFM provider.
Dolomite have released the Mitos Dropix Droplet Merging System. It meets the needs of microfluidic applications that benefit from an advanced capability; the ability to combine pairs of droplets in a controlled manner.
The collaboration aims to further refine and develop Haydale?s proprietary ink formulations to fully commercialize graphene based inks and coatings to realise their true potential in industrial and commercial applications.
The laser debonder can be used as a stand-alone, semi-automated system or as an integrated process module in SUSS MicroTec's XBC300 Gen2 platform. The debonding method used in the ELD300 relies on a 308nm Excimer laser to separate the glass carrier from a tape mounted thin wafer.
Demonstrating its expertise in precision materials engineering, Applied Materials, Inc. today announced two new systems that help customers solve critical challenges in manufacturing high-performance, power-efficient 3D devices.