Javelin Design Automation, the leading provider of PathFinding solutions, announces a revolutionary solution for the rapid design exploration and optimization of three dimensional stacked ICs (3D SIC).
To answer handset manufacturers' diverse requirements in the rapidly-evolving Smartphone and Mobile Internet Device (MID) markets, Texas Instruments Incorporated (TI) announced today that it has extended its popular OMAP 3 family with new 45-nanometer products.
Nasdaq is reviewing Arrowhead's eligibility for continued listing on The Nasdaq Global Market and has asked the Company to provide a specific plan to achieve and sustain compliance with all Nasdaq listing requirements by February 26, 2009.
For 22nm and beyond, patterning candidates such as EUVL, nano-imprint, direct write and optical double patterning methods show promise. But which one will deliver the best balance of performance and cost?
Applied Materials, Inc. today conducted a simulation of the 'carbon-free' transportation of the future at its Silicon Valley research campus, connecting battery-operated vehicles into the electrical grid utilizing energy generated by the company?s parking lot-based solar array.
Dr Neil Lewis, Technical Director for Malvern Instruments, will lead a two-hour interactive conferee networking session at this year?s Pittcon Conference and Expo in Chicago, and is seeking input from interested parties, whether or not they are able to attend in person.
Veeco Instruments Inc., a leading provider of atomic force microscopes (AFMs) to the nanoscience community, announced today that it will host the ?Seeing at the Nanoscale VII? conference at the University of California, Santa Barbara.
SanDisk Corporation and Toshiba Corporation today announced the co-development of multi-level cell (MLC) NAND flash memory using 32-nanometer (nm) process technology to produce a 32-gigabit (Gb) 3-bits-per-cell (X3) memory chip.