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3M and EV Group Settle Patent Infringement Suit

3M and EV Group (EVG) have agreed to settle the patent infringement litigation brought by EVG against 3M in the U.S. District Court for the Southern District of New York relating to systems for temporary wafer bonding.

Posted: Dec 22nd, 2008

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EAG, Inc. Agrees to Acquire Nano Integrated Solutions, Inc.

EAG, Inc., a leading global provider of surface analysis and materials characterization services, and microelectronic 'release to production' and failure analysis services, announced today that it has entered into a definitive agreement to acquire Nano Integrated Solutions, Inc.

Posted: Dec 22nd, 2008

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Analyzing Christmas Chocolate Using PANalytical X'Pert PRO

In a series of programs spotlighting innovative local companies, Dutch regional TV has recently featured Almelo-based analytical X-ray specialists, PANalytical. In one program, students were set a seasonal challenge - to identify which Christmas chocolate had been contaminated with a sleep-inducing drug.

Posted: Dec 19th, 2008

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nLIGHT Introduces Large Mode Area All Erbium Fibers

nLIGHT Corporation announced today the availability of very large mode area, low numerical aperture, all erbium fibers manufactured using its proprietary Direct Nanoparticle Deposition active fiber production technology.

Posted: Dec 19th, 2008

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Thickness Monitoring of Thin-Film Solar Cell Processes

LayTec is currently developing the product for in-line monitoring of thin-film solar cell production processes. The upcoming sensor systems will measure the thickness of all functional layers and provide information on optical properties of the layer materials as well as surface roughness and formation of interdiffusion regions between layers.

Posted: Dec 18th, 2008

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