Picosun Oy, a leading Atomic Layer Deposition (ALD) equipment manufacturer, presents PICOSUN P-1000 ultra-large scale batch ALD tool - the latest addition to the fully automated, high throughput PICOSUN P-series ALD reactors.
ParticleFinder was developed as part of a collaboration with Particle Sciences, Bethlehem, PA, to support their client drug product formulation and analytic, bioanalytic, physical characterization services.
TESCAN, a leading manufacturer of scanning electron microscopes and focused ion beam workstations, will introduce the newest generation FESEM platform MAIA at the upcoming Microscopy and Microanalysis 2013 trade show in Indianapolis, IN, USA, August 5 to 8, 2013.
Precision positioning specialist PI (Physik Instrumente) releases a more affordable version of the M-663 piezo motor positioning stage for new applications where speed, repeatability and compact dimensions are critical, but nanometer resolution is not required.
Using its patented liquid phase deposition (LPD) process, a cadmium/selenium absorber layer has been grown on a single-walled carbon nanotube-derived back contact substrate. The CdSe/SWNT layers show appropriate photo response. LPD was also used to grow a copper/selenium window layer onto which silver contacts were deposited. The resulting photovoltaic device shows a characteristic IV curve that confirms the potential for this process to form a flexible solar cell.
SEMATECH today that Air Products, a global industrial gas and technology leader, has joined its Front End Processes (FEP) program, and will work with SEMATECH to assess advanced materials and technologies for the development of sub-10 nm node III-V devices.
Azaya Therapeutics Inc., an oncology company focused on developing more effective cancer treatments through its nanotechnology platform, announced the launch of a new division, Parexo Labs, a contract development and manufacturing organization providing chemical testing and liposomal manufacturing services to outside organizations.
Cadence Design Systems today announced that the design services company, Global Unichip Corporation, utilized the Cadence Encounter Digital Implementation System and Cadence Litho Physical Analyzer to successfully complete the tape out of a 20nm system-on-a-chip test chip.
The announcement signals expanded opportunities for both organizations to combine their expertise toward the development and broader adoption of 3D integrated circuit (IC) packaging technologies, wherein IC chips are stacked in vertical 3D architectures.
Applied Materials, Inc. today announced a suite of new defect review and classification technologies for its market-leading SEMVision family of products to accelerate time to yield for leading-edge chip manufacturing at 1X-nm and beyond.
New NMOS epitaxy deposition process is essential for faster transistors inside next-generation mobile processor chips. NMOS epitaxy boosts transistor speed by the equivalent of half a device node without increasing off-state power consumption.
LayTec announced its cooperation with Meyer Burger, a global technology group specializing in systems, product equipment and services along the photovoltaic value chain including the manufacturing processes for wafers, solar cells, solar modules and solar systems. Combined efforts of both companies resulted in the world's first fully integrated EVA cross-linking metrology solution for PV module production lines.