Tessera Technologies, Inc., a leading provider of miniaturization technologies for the electronics industry, announced today that Advanced Wafer Level Packaging Inc. (AWLP) has licensed the full range of SHELLCASE image sensor packaging technologies from Tessera.
Veeco Instruments Inc. announced today that its new InSight 3D Automated Atomic Force Microscope (3DAFM) Platform has been accepted by a key global semiconductor customer for Critical Dimension (CD) Reference Metrology for Optical Proximity Correction (OPC) modeling.
Bruker AXS announced that it will launch its new G4 PHOENIX combustion analysis system with an infrared furnace for the determination of diffusible hydrogen next week at the FABTECH International and AWS Welding Show 2008 in Las Vegas
Nanophase Technologies, a leader in nanomaterials and advanced nanoengineered products, today announced several internal promotions and a realignment of management responsibilities to more effectively identify and capitalize on market opportunities.
Nanoledge Inc., a high performance resins manufacturer specializing in the integration of nanoparticles into composites and the development of environmentally friendly materials, announced today that it has closed a multi-million dollar Series A round of venture financing.
Nanotailor, Inc., a nanomaterials company specializing in the manufacturing of Single-Walled Carbon Nanotubes, announced today that in cooperation with the Nanomaterials Application Center [NAC] at Texas State University-San Marcos, Nanotailor will have a presence at the upcoming NanoTXUSA'08 Conference and Expo.
Enable IPC Corp., a leading company for turning technologies into products and successfully bringing them to market, today announced that its efficient energy-focused subsidiary SolRayo LLC has been awarded a $250,000 clean energy grant.
The introduction of a new international standard (ASTM International standard F2617-08, announced 26 September 2008), uses XRF analysis for routine testing of toxic heavy metals in homogeneous polymers.
CVD Equipment Corporation announced a new order quarterly booking record for the three month period ending September 30, 2008 of $5.9 million. This represents an increase of 16% over the same period in 2007 and a 20% increase over the previous quarter.
SUSS MicroTec, supplier of innovative solutions for 3D Integration (3DI), MEMS, Advanced Packaging and Nanotechnology markets, launches the third generation of its MA/BA8, a manual mask and bond aligner that offers highest process flexibility including submicron alignment and exposure optics dedicated for thick resist exposure.
After formal closing of its recent acquisition of Karmiel (Israel) based Pixer Technology Ltd., Carl Zeiss SMT's Semiconductor Metrology Systems division (SMS) presents its market-leading suite of closed-loop product solutions at Semicon Europa (Stuttgart, Germany) and SPIE/BACUS Photomask Symposium (Monterey, CA).
Syntec Optics, recipient of the prestigious 2008 Frost and Sullivan Growth Excellence Award in the North American polymer optics market, announces new manufacturing capacity that directly correlates with its focus on innovation.