Olympus and Digital Surf have announced an agreement whereby Olympus will supply users of its LEXT OLS3100 confocal laser scanning microscope (cLSM) with 3D surface texture and micro-geometry analysis software based upon Digital Surf's Mountains technology.
Applied Materials, Inc. announced today that it has signed a five-year service contract with Green Energy Technology Inc. (GET) of Taiwan to support GET's Applied SunFab Thin Film Line for solar module manufacturing.
Applied Materials is advancing semiconductor research with an equipment and service donation to the University of California, Berkeley?s Nanofabrication Laboratory in the Center for Information Technology Research in the Interest of Society (CITRIS).
Octillion Corp., a next-generation alternative and renewable energy technology incubator, today announced its sponsorship of the 2008 Nanoscale Science and Engineering Conference at Oakland University.
STMicroelectronics, STATS ChipPAC, and Infineon Technologies AG today announced that they have signed an agreement to jointly develop the next-generation of embedded Wafer-Level Ball Grid Array technology, based on Infineon's first-generation technology, for use in manufacturing future-generation semiconductor packages.