Asylum Research, a premier manufacturer of atomic force microscopes, announced that the federal court in Los Angeles dismissed two of the five Veeco Instruments Inc. patents from the infringement lawsuit commenced by Veeco in September 2003 and that the judge's summary judgment order cast a large shadow over their remaining patents.
CVD Equipment Corporation announced today that Gary Dyal, Director of Marketing and Sales will present at the 3rd Annual Axiom Capital/Livingston Nanotechnology Conference at the Marriott Financial Center in New York City on December 7th, 2007.
Ronald DeMeo, MD, MBA, president and chief executive officer with Radiation Shield Technologies, today announced the company's acquisition of Russia and Singapore patents for Demron, the world's first nuclear radiation-blocking fabric.
According to a new technical market research report, the U.S. market for molecular, nanoscale, and atomic imaging was worth some $1.6 billion in 2006 and is expected to increase to $1.8 billion in 2007 and $4.2 billion by 2012.
BIND Biosciences, Inc., a privately held biopharmaceutical company developing 'smart' therapeutic targeted nanoparticles capable of differential delivery and controlled drug release to diseased tissue, announced today that it has secured a $16 million Series B financing.
VESTA Technology, Inc., a leading supplier of production proven thermal process systems and an industry innovator in atomic layer deposition (ALD), today announced it received a multi-chamber order for its VULCAN Single wafer High-k and Metal ALD system from the largest leading foundry based in Taiwan.
Industrial Nanotech, Inc. announced today that the Agricultural University of Athens has confirmed that the Company’s patented Nansulate coatings save energy with no detriment to plant growth in commercial agricultural greenhouse applications.
Applied Materials, Inc. today unveiled its Applied UVision 3 system, the industry's highest productivity DUV1 Brightfield wafer inspection tool with the critical-defect detection sensitivity required for 45 nanometer (nm) FEOL2 and immersion lithography.