Researchers sponsored by Semiconductor Research Corporation (SRC) today announced that they have developed a new laser-based method for ultra-fast anneal of thin photoresist films used to transfer semiconductor patterns onto silicon wafers.
Samsung Electronics, Co., Ltd., a world leader in advanced semiconductor technology solutions, announced foundry production of STMicroelectronics' leading products using 32/28nm High-K Metal Gate (HKMG) process technology.
Biodico, Inc. and LamdaGen Corporation have announced a collaboration whereby LamdaGen's nano-based Meta-Catalytic Surface technology will be integrated into Biodico's Research & Development programs for biomass-based diesel, combined heat and power, and biochemicals.
FEI announced that it has added patented UniColore (UC) monochromated electron source to its versatile Versa 3D DualBeam system. The press release is attached along with a photo of the Versa 3D DualBeam System.
Ensysce Biosciences Inc. announced today they have received a SBIR award of roughly $300,000 to optimize the formulation of their single walled carbon nanotube (SWCNT)/siRNA complex for therapeutic delivery.
Cambrios Technologies Corporation, the leader in nanotechnology-based solutions for transparent conductive electronic devices, today announced its collaboration with prominent film processing maker, Okura Industrial Co. Ltd., to create a family of high performance transparent conductive films based on the Cambrios ClearOhm coating material.
The 20/20 PV gives you the ability to collect Raman, UV-visible-NIR absorbance, reflectance and fluorescence spectra of microscopic samples and sample areas. This is in addition to UV-visible-NIR imaging, film thickness measurements and micro-colorimetry.
These modules include the latest MII proprietary Jet and Flash Imprint Lithography technology which delivers the performance required for high volume manufacturing of advanced semiconductor memory devices.
International team of scientists will research into carbon-based materials for use in energy storage systems and electronic applications. Investment in Carbon Materials Innovation Center adds up to 10 million euros.
At this week's European Photovoltaic Solar Energy Conference and Exhibition, imec, RENA and SoLayTec present thin, large area i-PERC-type Silicon solar cells with atomic layer deposition passivation achieving a cell efficiency of 19.6% without selective emitter using an industrial screen printing process flow.