Today, at the IEEE IITC conference, nano-electronics research center imec and Tokyo Electron Limited (TEL) presented a direct Cu etch scheme for patterning Cu interconnects. The new scheme has great potential to overcome resistivity and reliability issues that occur while scaling conventional Cu damascene interconnects for advanced nodes.
The US Environmental Protection Agency (EPA) proposed a new rule detailing one-time reporting and record-keeping requirements for manufacturers and processors of nanoscale materials under Section 8(a) of the Toxic Substances Control Act (TSCA).
By modeling the average mollusk's mobile habitat, researchers are learning how shells stand up to extraordinary pressures at the bottom of the sea. The goal is to learn what drove these tough exoskeletons to evolve as they did and to see how their mechanical principles may be adapted for use in human-scale structures like vehicles and even buildings.
Engineers have taken a step forward in creating the next generation of computers and mobile devices capable of speeds millions of times faster than current machines. They have developed an ultracompact beamsplitter - the smallest on record - for dividing light waves into two separate channels of information.
Researchers have developed a low-cost technique that holds promise for a range of scientific and technological applications. They have combined laser printing and capillary force to build complex, self-assembling microstructures using a technique called laser printing capillary-assisted self-assembly (LPCS).
An almost 4% absolute increase to the previous record is achieved by applying a thin passivating film on the nanostructures by Atomic Layer Deposition, and by integrating all metal contacts on the back side of the cell.