Researchers have created a new type of 'ultracold' molecule, using lasers to cool atoms nearly to absolute zero and then gluing them together, a technology that might be applied to quantum computing, precise sensors and advanced simulations.
Researchers have discovered that even simple systems, such as neutral atoms, can possess chaotic behavior, which can be revealed using the tools of quantum mechanics. The ground-breaking research opens up new avenues to observe the interaction between quantum particles.
Will one-atom-thick layers of molybdenum disulfide, a compound that occurs naturally in rocks, prove to be better than graphene for electronic applications? There are many signs that might prove to be the case. But physicists have shown that the nature of the phenomena occurring in layered materials are still ill-understood and require further research.
Researchers have discovered that creating a graphene-copper-graphene 'sandwich' strongly enhances the heat conducting properties of copper, a discovery that could further help in the downscaling of electronics.
Faster, smaller and more energy efficient ? that is what tomorrow's computers should look like. This means that data needs to be written and processed faster. Physicists are now a great deal closer to that goal.
In an effort to better understand the challenges stalling the electric car, an international research team has been investigating batteries and battery materials and have revealed a new underlying mechanical interaction that occurs during the carbon coating process.
Biomedical engineering researchers have developed a new technique that uses adenosine-5'-triphosphate (ATP), the so-called 'energy molecule', to trigger the release of anti-cancer drugs directly into cancer cells.
CEA-Leti announced today it has fabricated ultra-scaled split-gate memories with gate length of 16nm, and demonstrated their functionality, showing good writing and erasing performances with memory windows over 6V.
3D IC stacking is the most promising way to extend the limit of the miniaturization of large-scale-integration of 2D circuits on Si chips. A new paper discussed some major metallurgical challenges in microelectronic 3D IC packaging technology. It provides a deep insight of the further efforts needed in developing this technology.