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Imec performs world-leading research in nano-electronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven (Belgium) and has offices in the Netherlands, Taiwan, US, China, Japan and India. Its staff of more than 2,000 people includes over 550 industrial residents and guest researchers. In our Process Technology (PT) unit we are currently looking for a (m/f) Senior Process Integration Engineer.
Your mission will be to define and coordinate the development and integration of multi die stacking approaches (2D, 2.5D, 3D). You will explore different die-to-die (D2D), die-to-wafer (D2W) and collective die-to-wafer (C2W) thermocompression bonding (TCB) schemes. You will review the impact of these schemes on the overall needs of the 3D program. - You plan development activities for the process module assigned to you. You will follow-up on the processing (at both wafer and die level) of test material, collect and analyze performance data. You report results both internally as well as to customers. You will be supported in your task by a Process Assistant, but will be expected to take a significant hands on role within the clean room. - You will be responsible for discussing process splits with the characterization and/or process development engineers, as well as for the implementation of these splits into process flows. - You keep your level of scientific know-how up to date and benchmarks imec’s expertise and performance in your competence domain with the rest of the world. - You regularly report to your team leader, program manager, program director or to the customers on progress and results as well as on new opportunities. - You will be member of the 3D Technology department where you will interact with process engineers, process assistants, test and reliability engineers as well as with industrial residents. Good communication and interaction within the 3D Technology department as well as with the CMOS technology department and Fab operations unit, is a major requirement for this job. - You will represent Imec in contacts with third parties and representatives for semiconductor players from around the globe for matters that relate to your field of competence. - You will operate from imec’s HQ located close to Brussels in the heart of Europe.
You have obtained a PhD or Master degree in either materials science, mechanical engineering or electronics engineering, preferably combined with some relevant industrial experience. - You have 5-10 years experience in a semiconductor environment. A background in IC assembly is an asset. - Experience in 3D stacking schemes such as Die-to-Die, Die-to-Wafer and Wafer-to-Wafer thermocompression bonding a definite advantage. - Experience in transient liquid phase, solid metal bonding, Cu-Cu direct and insertion bonding an advantage. - You have experience in presenting scientific results (publications, conferences, seminars). - You are an enthusiastic team player with project management capabilities. You are able to complete your tasks in time with minimal supervision. -You have good English communication skills. -You are willing to work in a highly competitive and multicultural environment.