- You research novel material and process opportunities for assembly and packaging of 3D chip stacks. Examples of topics of potential interest are methods, materials and processes for die self alignment, collective bonding of multiple dies, wafer reconstruction, handling solutions for extremely thin dies and wafers, package level reliability of die stacks, ...
- You operate independently under the guidance of the imec’s 3D R&D program. You are responsible for the design and evaluation of experiments. You generate, develop and demonstrate novel ideas in the above cited fields of interest.
- You report both internally as well as externally, to peers, to imec partners and at conferences. You prepare and publish scientific manuscripts in line with the policies of imec’s 3D program.
- You keep your level of scientific know-how up to date and benchmarks imec’s expertise and performance in your competence domain with the rest of the world.
- You will be member of the 3D Assembly Integration Team that is part of the 3D Technology department. You will interact with process engineers, process assistants, test and reliability engineers as well as with industrial residents. Good communication and interaction within the 3D Technology department as well as with Fab operations unit, is a major requirement for this job.
- You will report to the 3D Assembly Integration Team Leader.
- You will operate from imec’s HQ located close to Brussels in the heart of Europe.
- You have obtained a PhD of Science in Physics, Chemical or Electronic Engineering.
- You have experience in presenting scientific results (publications, conferences, seminars).
- You are an enthusiastic team player with project management capabilities. You are able to complete your tasks in time with minimal supervision.
- You have good English communication skills.
- You are willing to work in a highly competitive and multicultural environment.
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| Organization Description: | ||||||||||||
Imec performs world-leading research in nano-electronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven (Belgium) and has offices in the Netherlands, Taiwan, US, China, Japan and India. Its staff of more than 2,000 people includes over 550 industrial residents and guest researchers. In our Process Technology (PT) unit we are currently looking for a (m/f) Postdoctoral Researcher for 3D Stacking and Packaging Pathfinding for 3D. |
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| Job Description: | ||||||||||||
| Requirements: | ||||||||||||
This postdoctoral position is funded by imec through the KU Leuven. Because of the specific financing statute which targets international mobility for postdocs, only candidates who did not obtain their PhD degree from a Belgian university can be considered for the position. Applicants who stayed or worked/studied in Belgium for more than 24 months in the past 3 years are not eligible either (short stays such as holiday, participation in conferences, etc are not taken into account). |
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| Job Application: | ||||||||||||
We offer a challenging position for 2 years in an advanced high-tech environment and in an international, interdisciplinary team. Further, we offer the opportunity to contribute to technologies that will have an impact on the society of tomorrow. The salary is competitive. Furthermore, imec offers various training possibilities and social services, such as a company restaurant, the possibility of day care, and discounts in different sport clubs and shops.
Interested? Please apply online at www.thinksmall.be including your curriculum vitae, publication list and contact details of at least one referee. |
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| Email application to : | jobs@imec.be | |||||||||||
| Date Posted: | November 8, 2012 | |||||||||||