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Imec performs world-leading research in nano-electronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven (Belgium) and has offices in the Netherlands, Taiwan, US, China, Japan and India. Its staff of more than 2,000 people includes over 550 industrial residents and guest researchers.
In our Process Technology unit the REMO (Microsystems reliability, test and modeling) group of imec is worldwide known for its R&D on reliability, test and modeling of innovative microelectronic devices and assemblies (e.g. 3D stacking, back-end-of-line, MEMS, photovoltaic, GaN).
One of the main concerns in the design of micro-electronic components is the thermal behavior and thermo-mechanical reliability.
A strong “design for thermal-mechanical reliability” tool used at imec is finite element modeling (FEM), which can be used to simulate, in a virtual environment, temperature increases and/or mechanical deformations generating stresses that can exceed the strength limit of the materials. Examples include the temperature increase in a micro-processor inside a laptop, the stress in and around a through silicon copper via for 3D stacking, the stress imposed by packaging on stacked and thinned chips, the stretch ability of electrical conductors for biomedical applications, etc. The simulation software allows predicting major hardware failures, caused by excessive temperature hot spots or critical mechanical stresses. Simulation tools are used to optimise the design in order to avoid these failures.
Together with a team of experienced engineers, you will perform leading-edge research on thermal and mechanical designs of advanced IC-packages using finite element software tools. You discuss with both internal and external customers to understand thermo mechanical challenges for future electronic system solutions. You suggest geometrical designs and material choices to study or address these. You use advanced finite element software tools to model, conceptualize, design and develop novel solutions for minimizing the risk of thermo-mechanical failures in advanced, packaged chip assemblies. You will set-up experiments to validate simulation models. You document report on simulation and experimental results. You will be involved in different research activities, which are part of multidisciplinary projects.
- You have a Master or PhD degree in Engineering or Physics (thermal, mechanical or material sciences) or equivalent by experience.
- You have Finite Element Modelling experience and have a proven understanding of thermal, mechanical and coupled simulations.
- You have a background in reliability issues in micro/nano-electronics and/or experimental validation of modeling results is a strong asset.
- You have an entrepreneurial attitude with a strong sense of ownership and drive for results.
- Being critical for your results is crucial.
- You can work independently but with focus on team and program results, as a team member.
- Willingness to travel occasionally in the framework of international conferences and projects