| Posted: April 29, 2009 |
TOK Joins SEMATECH's Resist Materials and Development Center at UAlbany |
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(Nanowerk News) SEMATECH, a global consortium of chipmakers, and Tokyo Ohka Kogyo Co., Ltd. (TOK), a leading manufacturer of photoresists, announced today that TOK has joined SEMATECH’s Resist Materials and Development Center (RMDC) at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany.
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The RMDC’s mission is to develop resist and materials for 22 nm patterning technologies and beyond, and consists of both extreme ultraviolet (EUV) exposure capability and a portfolio of sponsored university research programs. TOK will team with researchers at SEMATECH to develop and demonstrate EUV materials and resists for use at the 22 nm node and beyond.
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“We are pleased to welcome TOK as a member, and we are confident this collaboration will help us build upon the excellent work that SEMATECH’s lithography researchers have undertaken to drive the development of resist and materials that are critical for continued progress in manufacturing,” said John Warlaumont, vice president of advanced technologies at SEMATECH. “This new partnership is the latest example of SEMATECH’s ongoing effort to create flexible participation options that will enable broader and deeper partnerships for advanced materials development.”
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“The critical effort to develop and commercialize EUVL technology for the manufacturing of future nanoelectronics devices will be enhanced by the addition of Tokyo Ohka Kogyo to SEMATECH’s Resist Materials and Development Center at CNSE’s Albany NanoTech,” said Richard Brilla, CNSE Vice President for Strategy, Alliances and Consortia. “This new partnership will enable additional cutting-edge capabilities at the UAlbany NanoCollege, building on the global leadership of New York State in nanotechnology education, research and development, and economic outreach.”
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At the RMDC, leading resist and materials suppliers have access to SEMATECH’s two micro-exposure tools (METs) located at the University at Albany’s College of Nanoscale Science and Engineering and University of California at Berkeley, and can participate in focused, cooperative R&D with SEMATECH member companies. They also have access to the several metrology tools located in SEMATECH’s RMDC.
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“The RMDC brings together the critical capabilities needed to enable manufacturable EUV,” said Bryan Rice, director of Lithography at SEMATECH. “Partnering with resist suppliers such as TOK will accelerate EUV resist development and, in turn, will support timely EUVL introduction.”
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