| Posted: June 4, 2009 |
SEMATECH hosts workshop on 3D interconnect metrology |
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(Nanowerk News) Successful introduction of 3D interconnects will require that equipment suppliers and device manufacturers overcome the inherent challenges associated with measuring opaque films and high-aspect ratio features that dominate 3D architectures.
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Metrology for 3D architectures requires new techniques, revisiting and improving some older techniques, and breakthrough innovations to create new metrology tools.
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The purpose of this Workshop on 3D interconnect metrology is to gain a better understanding of how new and existing wafer metrology technologies can be utilized, modified or enhanced to measure and improve 3D interconnect processes. Metrology results for actual 3D interconnect processing will be shown.
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Who Should Attend?
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This workshop will benefit researchers, IC manufacturers, back-end foundries, equipment and material suppliers, unit process engineers and metrologists responsible for the development and/or implementation of 3D interconnect technology.
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