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Posted: June 30, 2009
Nova Receives Multiple Metrology Orders for 45 nm Copper
(Nanowerk News) Nova Measuring Instruments Ltd., provider of leading edge stand-alone metrology and the market leader of integrated metrology solutions to the
semiconductor process control market, received a multiple tool order for its
integrated NovaScan metrology solution for measurement of Copper line
thickness by a leading foundry.
The integrated systems will complement the already deployed standalone NovaScan systems as part of that foundry's Copper
CMP process control scheme. The correlation of Copper line thickness
measurements by NovaScan metrology to electrical tests provides critical
information at an early stage of the device manufacturing process. The
combination of integrated and standalone metrology provides the manufacturing
fab the flexibility to visualize the Copper process on a wafer-to-wafer high
sampling basis or on lower sampling basis depending on specific process
The resistivity of metal interconnect lines directly affects the
performance and power consumption of the device. As semiconductor devices
shrink, lower resistivity Copper replaces the higher resistivity Aluminum as
the interconnect metal. As Copper process control is more challenging than
Aluminum, there is a need for metrology to measure accurately the profile of
the Copper line that ultimately determines the line's resistivity.
Scatterometry has a unique capability to provide fast, accurate non contact
measurements of Copper line thickness and to detect Copper residues that can
degrade device performance and lower yield.
"As our customers continue to develop their advanced processes we are
committed to continue cooperating with them to provide the metrology
solutions they need", said Noam Shintel, Corporate Marketing Director for
Nova. "For technology nodes of 45nm and below we see a move from Copper
process monitoring on solid measurement pads to a comprehensive control
scheme where the Copper line trench is measured after Etch and the Copper
line thickness is measured on 2D and 3D test targets after CMP. The
deployment of NovaScan is indicative that our adaptive solution of fully
matched high throughput standalone and integrated metrology coupled with
NovaMARS 3D modeling software enables control of Copper processes in advanced
technology nodes. With Advanced Process Control (APC) and Nova's metrology
solutions, semiconductor manufacturers are able to significantly reduce their
process development cycle, increase the device performance and overall yield."
Nova Measuring Instruments Ltd. develops, produces and
markets advanced integrated and stand-alone metrology solutions for the
semiconductor manufacturing industry.
Source: Nova Measuring Instruments (press release)