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Posted: August 13, 2009
Shocking Technologies Secures $10M in Second Round Funding
(Nanowerk News) Shocking Technologies, Inc., a privately held company developing Voltage Switchable DielectricTM (VSDTM) materials used for electrostatic discharge protection of cell phones, LED’s, semiconductors, and electronics, today announced it has raised $10M in the second round of funding led by Vista Ventures. Other participating investors include ARCH Venture Partners, ATA Ventures, Balch Hill Partners and private investors. Shocking Technologies is pleased to welcome Simon Michael, from Balch Hill Partners, as the newest member to the board of directors.
“Shocking’s embedded nano-composite technology solves a problem that has been plaguing the electronics industry for years. It will make design at both the system and chip level considerably easier and more effective” said Jim Hogan of Vista Ventures.
“We have been very fortunate that we’ve identified a huge problem and have been able to develop our unique patented solution,” said Lex Kosowsky, president and chief executive officer at Shocking Technologies. “The funding will allow us to build out our manufacturing infrastructure and continue our development as we work with our customers to bring our initial products, cell phones and flash drives to market in the coming months.”
About Shocking Technologies, Inc.
Shocking Technologies, Inc. is a privately held, venture-backed company developing “Voltage Switchable DielectricTM material is a polymer nano-composite that behaves like an insulator (dielectric) during normal circuit operation and becomes conductive when the voltage across the VSDTM material increases beyond a predefined threshold voltage. After the voltage drops below the threshold again, it switches back to an insulator. This unique property, coupled with the ability to tailor the response of the material, opens up several new areas in electronics. The first application being introduced enables embedded electrostatic discharge (ESD) protection in printed circuit boards (PCBs) and semiconductor packages. Subsequent applications will usher in new manufacturing processes as well as novel product designs.