(Nanowerk News) Semiconductor Manufacturing
International Corporation ("SMIC") today
announced that it will extend its 45-nanometer bulk complementary metal-oxide
semiconductor (CMOS) technologies to 40nm and 55nm geometries.
These new processes will complement SMIC's existing offerings to better
support customer demand worldwide, including in the fast-growing China market.
Applications include multimedia products, graphics chips, chipsets, and mobile
devices such as handsets integrated with 3G/4G.
"Our 45nm technology has been implemented at SMIC's 300mm facility in
Shanghai ahead of schedule and we look forward to a similar result at these
additional geometries," said SMIC's President and CEO, Dr. Richard Chang.
"These new offerings provide our current and new customers a customized set of
solutions to meet their diverse product design-in needs."
About SMIC
Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI;
SEHK: 981) is one of the leading semiconductor foundries in the world and the
largest and most advanced foundry in Mainland China, providing integrated
circuit (IC) foundry and technology services at 0.35um to 45nm. Headquartered
in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and
three 200mm wafer fabs in its Shanghai mega-fab, two 300mm wafer fabs in its
Beijing mega-fab, a 200mm wafer fab in Tianjin, a 200mm fab under construction
in Shenzhen, and an in-house assembly and testing facility in Chengdu. SMIC
also has customer service and marketing offices in the U.S., Europe, and Japan,
and a representative office in Hong Kong. In addition, SMIC manages and
operates a 200mm wafer fab in Chengdu owned by Cension Semiconductor
Manufacturing Corporation and a 300mm wafer fab in Wuhan owned by Wuhan Xinxin
Semiconductor Manufacturing Corporation.
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