Open menu

Nanotechnology General News

The latest news from academia, regulators
research labs and other things of interest

Posted: November 3, 2009

Ultratech Receives Follow-On Order for TSV Applications

(Nanowerk News) Ultratech, Inc., a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices, today announced that it has received a follow-on order for its AP200 lithography system, which features an innovative dual-side alignment (DSA) system for through-silicon via (TSV) applications. Built on its customizable Unity Platform, Ultratech's systems are the exclusive tool of record at this customer's facility--one of the first Japanese companies to enter into volume production of image sensors.
According to Jan Vardaman, president and founder of TechSearch International, "The level of TSV activity in the last few quarters has increased dramatically. Today, image sensors with TSVs are shipping in high volume for cameras in mobile phones. The next target for mobile phones is memory and processor applications. By the year 2012, millions of wafers will ship with TSVs."
"This follow-on order validates the technology leadership and economic value associated with the use of steppers for via last TSV applications," said Manish Ranjan, director of product marketing for advanced packaging at Ultratech. "The increasing importance of packaging technology for the TSV market is exciting for the entire supply chain and Ultratech, as a market leader, is well positioned to gain from the continued adoption of TSV technology. We look forward to working closely with this valued customer and providing lithography systems that are cost-effective and extendible for multiple generations."
About Ultratech
Ultratech, Inc. designs, manufactures and markets photolithography and laser processing equipment. The company's market-leading advanced lithography products deliver high throughput and production yields at a low, overall cost of ownership for bump packaging of integrated circuits and LEDs. Ultratech, a pioneer of laser processing, developed laser spike anneal technology, which increases device yield, improves transistor performance and enables the progression of Moore's Law for 65-nm and below production of state-of-the-art consumer electronics. Founded in 1979, Ultratech celebrates 30 years headquartered in San Jose, Calif.
Source: Ultratech (press release)
Bookmark Nanowerk Directory

Subscribe to a free copy of one of our daily
Nanowerk Newsletter Email Digests
with a compilation of all of the day's news.