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Posted: December 7, 2009
ASM International N.V. Features Innovative Atomic Layer Deposition Processes at Luncheon Seminar
(Nanowerk News) ASM International N.V. today announced that it
will be hosting a technical luncheon seminar in Baltimore, Maryland,
on Wednesday, December 9, 2009, the last day of the International
Electron Devices Meeting (IEDM). The seminar will address important
materials, equipment and process innovations that enable high-k and
metal gates in volume manufacturing, including processes using Atomic
Layer Deposition (ALD) and Plasma Enhanced ALD (PEALD).
The event will be presented in two parts:
Part 1: 11:30 - 12:15 -- Walk-in Poster Session and Lunch Buffet.
Part 2: 12:15 - 13:00 -- Presentations:
– Philippe Absil (IMEC) on "ALD High-k and Metal Gates Process
– Hyung Sang Park (ASM) on "Low Temperature PEALD SiO and SiN
Following the presentations, there will be an open dialogue around
the posters and presentation topics.
The ASM seminar will take place in the Stadium Ballroom at the Hotel
Baltimore Marriott Inner Harbor at Camden yards, 110 South Eutaw
Street, Baltimore, Maryland, less than 150 meters from the Hilton
Baltimore. The room will open at 11:30. Interested parties should
contact Rosanne de Vries, + 31 88 100 8569, Rosanne.firstname.lastname@example.org.
About ASM International N.V.
ASM International N.V., headquartered in Almere, the Netherlands, and
its subsidiaries design and manufacture equipment and materials used
to produce semiconductor devices. ASM International and its
subsidiaries provide production solutions for wafer processing
(front-end segment) as well as assembly and packaging (Back-end
segment) through facilities in the United States, Europe, Japan and