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Posted: December 7, 2009

ASM International N.V. Features Innovative Atomic Layer Deposition Processes at Luncheon Seminar

(Nanowerk News) ASM International N.V. today announced that it will be hosting a technical luncheon seminar in Baltimore, Maryland, on Wednesday, December 9, 2009, the last day of the International Electron Devices Meeting (IEDM). The seminar will address important materials, equipment and process innovations that enable high-k and metal gates in volume manufacturing, including processes using Atomic Layer Deposition (ALD) and Plasma Enhanced ALD (PEALD).
The event will be presented in two parts:
Part 1: 11:30 - 12:15 -- Walk-in Poster Session and Lunch Buffet.
Part 2: 12:15 - 13:00 -- Presentations:
– Philippe Absil (IMEC) on "ALD High-k and Metal Gates Process Solutions"
– Hyung Sang Park (ASM) on "Low Temperature PEALD SiO and SiN Spacers"
Following the presentations, there will be an open dialogue around the posters and presentation topics.
The ASM seminar will take place in the Stadium Ballroom at the Hotel Baltimore Marriott Inner Harbor at Camden yards, 110 South Eutaw Street, Baltimore, Maryland, less than 150 meters from the Hilton Baltimore. The room will open at 11:30. Interested parties should contact Rosanne de Vries, + 31 88 100 8569, Rosanne.de.vries@asm.com.
About ASM International N.V.
ASM International N.V., headquartered in Almere, the Netherlands, and its subsidiaries design and manufacture equipment and materials used to produce semiconductor devices. ASM International and its subsidiaries provide production solutions for wafer processing (front-end segment) as well as assembly and packaging (Back-end segment) through facilities in the United States, Europe, Japan and Asia.
Source: ASM (press release)

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