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Posted: January 19, 2010
SUSS MicroTec Expands Activities in Wafer-Level Camera Applications
(Nanowerk News) SUSS MicroTec, a leading supplier of process and test solutions for the semiconductor industry and related markets, announces that Q-Technology Limited (Q Tech), manufacturer of compact camera modules for the global cell phone, notebook computer and security industry, has successfully installed a full SUSS equipment set at Q Tech’s facility in Hi-Tech Industrial Park Kunshan City, Jiangsu Province, China. The 200mm mask and bond aligner, spin and spray coaters and wafer bond systems are utilized for Q Tech’s wafer-level camera manufacturing services. With this project SUSS MicroTec expands its activities as an equipment supplier supporting image sensor packaging and wafer-level camera manufacturing processes.
Wafer-level camera technology is capable of delivering significant size reduction over conventional camera modules in next-generation mobile devices like cell phones or PDAs. It is considered to be the first application to bring 3D packaging technologies into volume production. SUSS MicroTec’s equipment now in production at Q Tech provide the latest technology advancements for the most effective patterning. While its proven mask aligner technology allows for the highest alignment accuracy, SUSS wafer bonding systems offer tight temperature and force uniformity during bonding. The proprietary AltaSpray coating technology of SUSS MicroTec uses a revolutionary resist deposition method enabling conformal coating across flat and steeply sloped surfaces while covering topography steps up to 600 microns and more.
“The market demands smaller form factor packages with enhanced reliability and lower costs”, said Dr Hao Zhou, CEO, Q Tech. “To make this wafer scale process possible while achieving high yielding, we need reliable equipment that enables repeatable results. For us the leading-edge wafer-level packaging systems of SUSS MicroTec are the equipment of choice.”
“We are proud to further prove our expertise in wafer-level packaging of CMOS image sensors and manufacturing solutions of wafer-level cameras”, said Frank Averdung, President and CEO, SUSS MicroTec. ”With our complete solution portfolio and our expertise in micro-optics SUSS MicroTec can offer its customers a perfect partnership in this highly competitive growth market.”
Source: SUSS MicroTec (press release)
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