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Posted: January 20, 2010
Tessera to Present at Photonics West
(Nanowerk News) Tessera Technologies, Inc. will present at SPIE’s Photonics West during the Advanced Fabrication Technologies for Micro/Nano Optics and Photonics III conference.
WHO: Adam Fedor, Principal Engineer, Tessera
WHAT: Analysis, tolerancing and fabrication of a two-element diffractive beamshaper
WHERE: SPIE Photonics West, The Moscone Center, Room 112, Exhibit Level, San Francisco, California
WHEN: January 27, 2010, 10:40 am
In addition, Tessera will showcase its DigitalOptics™ micro-optic illumination system solutions at Booth #1122 in The Moscone Center’s South Hall.
Tessera Technologies, Inc. invests in, licenses and delivers innovative miniaturization technologies for next-generation electronic devices. The company's micro-electronics solutions enable smaller, higher-functionality devices through chip-scale, 3D and wafer-level packaging technology, as well as high-density substrate and silent air cooling technology. Tessera's imaging and optics solutions provide low-cost, high-quality camera functionality in electronic products and include image sensor packaging, wafer-level optics and image enhancement intellectual property. The company also offers customized micro-optic lenses, from diffractive and refractive optical elements to integrated micro-optical subassemblies. Tessera licenses its technologies, as well as delivers products based on these technologies, to promote the development of the supply chain infrastructure. The company is headquartered in San Jose, California.
Tessera, the Tessera logo and DigitalOptics are trademarks or registered trademarks of Tessera, Inc. or its affiliated companies in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.