(Nanowerk News) Broadcom Corporation, a global leader in semiconductors for wired and wireless communications, today announced a new single-chip HSPA (high-speed packet access) baseband processor and a radio frequency (RF) transceiver solution that integrates all of the key 3G (third generation) cellular and mobile technologies for powering the 3G smartphone and smart feature phone product segments.
The advanced baseband processor is the first to provide extremely high-speed cellular connectivity with advanced, built-in graphics capabilities, for HSUPA (high speed upstream packet access) applications. The RF transceiver solution complements the advanced HSUPA processor to provide support for all global frequency combinations covering the latest 3G-enabled devices.
Designed in Broadcom's proven 65 nanometer CMOS process, the new '3G phone-on-a-chip' and RF solution enables manufacturers to build low cost, low power, next generation 3G HSUPA phones with breakthrough features, sleek form factors and very long battery lives. Utilizing an integrated ARM11® processor that is capable of running popular open operating systems (such as Windows Mobile® and Android™), the Broadcom® BCM21553 HSUPA baseband processor can run innovative new applications and download media files at a much faster speed, resulting in sophisticated and affordable handsets, and a more satisfying smartphone experience.