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Posted: June 22, 2010

MOSIS, CMP and CMC Partner to Introduce a 3D-IC Process

(Nanowerk News) MOSIS, CMP and CMC are partnering to offer a 3D-IC Multi-Project Wafer (MPW) service based on Tezzaron Semiconductor's SuperContact technology and GLOBALFOUNDRIES' 130nm CMOS process.
The first MPW run is targeting January 2011:
  • 2-tier face-to-face bonded wafers
  • 130nm CMOS process for both tiers
  • Top tier exposing TSV and backside metal pads for wire bonding
  • A design-kit supporting 3D-IC design with standard-cells and IO libraries is available.
    Further MPW runs schedule supporting process flavors (multiple tiers beyond 2, different CMOS flavors for different tiers) will be driven by users' requirements.
    Potential users are encouraged to contact MOSIS/CMP/CMC for details (
    About MOSIS
    MOSIS provides fabrication services to designers of advanced integrated circuits (ICs). Through its global network of foundry partners, the company offers customers a faster and more affordable route to market with leading-edge solutions for prototype and low-volume production. MOSIS serves a large global customer base from its headquarters in Marina del Rey, California. More information about MOSIS is available at
    About CMP
    CMP is a broker in ICs and MEMS for prototyping and low-volume production. Circuits are fabricated for Universities, Research Laboratories and Industrial Companies. Advanced industrial technologies are available in CMOS, BiCMOS, SiGe BiCMOS and MEMS etc. CMP distributes and supports several CAD software tools for both Industrial Companies and Universities. Since 1981, more than 1000 institutions from 70 countries have been served, more than 6000 projects have been prototyped through 700 runs, and 56 different technologies have been interfaced. More information on CMP is available at
    About CMC
    CMC Microsystems is a non-profit organization formed in 1984 that supports microelectronics and microsystems R&D in Canada. CMC delivers engineering services, design tools, operates test labs and arranges manufacturing for clients who can also access a database of university-based collaborators, technology and economy based reports. Almost 400 prototyping projects per year lead to quantities of microchips -- microelectronics, MEMS, photonics, microfluidics or sensors, including more than 30 integrated Microsystems annually. More information about CMC is available at
    Source: MOSIS (press release)
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