The latest news from academia, regulators
research labs and other things of interest
Posted: June 29, 2010
Tegal Receives Order for Tegal 200 SE Silicon DRIE Process Tool From Leading MEMS Research Center
(Nanowerk News) Tegal Corporation, an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices, today announced it has received an order for a Tegal 200 SE™ DRIE tool from a leading Asia Pacific-based Research and Development institution investigating MEMS and associated technologies. The Tegal 200 SE DRIE tool will be shipped and installed at the customer's site later this calendar year.
The Tegal 200 SE silicon DRIE system order is from a first-time Tegal DRIE customer, and is the result of a thorough competitive evaluation the customer performed on a broad range of silicon DRIE tools and tool suppliers, including competitive solutions from the customer's home market.
"Our customer knows the path to technological leadership in MEMS research and development starts with choosing the right silicon DRIE tool for the work," said Yannick Pilloux, DRIE Product Manager at Tegal Corporation. "We believe that our DRIE 200 SE system and our deep silicon etch processes are the most reliable and most advanced on the market today and, combined with the excellent local support available from Tegal, resulted in Tegal having been chosen over our competitors, including the home-market competition."
The Tegal 200 SE™ is the best-adapted DRIE solution for 3D-SiP and MEMS volume manufacturing today. The tool is designed to achieve high throughput with low Cost of Ownership in production applications, thanks to the combination of extended time between cleaning, minimal wafer edge exclusion, high silicon etch rates, excellent process stability and highly uniform etching. The 200 SE results are obtained thanks to the implementation by Tegal of a wide range of proprietary hardware and process improvements to the standard Bosch process for deep silicon etch; these improvements include the Tegal patented heated liner, and the patented S.H.A.R.P. (Super High Aspect Ratio Process) process.
Tegal silicon DRIE tools are presently employed in numerous research and development laboratories throughout the world, engaging in both commercial and academic research programs, and are also found in MEMS foundries and other dedicated commercial High Volume Manufacturing lines world-wide.
About Tegal Corporation
Tegal is an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices found in products like smart phones, networking gear, solid-state lighting, and digital imaging. The Company's plasma etch tools enable sophisticated manufacturing techniques, such as 3D interconnect structures formed by intricate silicon etch, also known as Deep Reactive Ion Etching (DRIE). Tegal combines proven expertise with practical system strategies to deliver application-specific solutions that are robust and reliable, and deliver exceptional process quality and high yields at a lower overall cost of ownership. Headquartered in Petaluma, California, the company has more than 35 years of expertise and innovation in specialized technologies. Please visit us on the web at www.Tegal.com.