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Posted: Sep 29, 2010
Rehm Thermal Systems to Celebrate 20 Years of Innovation With Forthcoming Technology Days
(Nanowerk News) Having recently celebrated two decades of innovation in the thermal technology arena, the team at Rehm Thermal Systems is preparing to mark the occasion with a series of Technology Days in Blaubeuren-Seißen. Open to anyone with an interest in how the company's thermal technologies could transform their electronics or photovoltaic production processes, the events will be held over October 7th – 8th 2010.
Delivering an engaging programme of events, the Rehm Technology Days will feature specialist seminars on a wide range of topical industry issues, an exhibition of leading-edge technologies supported by partner companies and a fully functioning SMD line. The event will include presentations such as 'Causes of Assembly Group Failures' by Weptech's Oswald Maurer, 'Multifunctional Convection Soldering Systems' by Rehm's Dr. Hans Bell, 'Backside Reflow Soldering' by Endress & Hauser's Dietmar Birgel, 'New Developments in Silicon Photovoltaics' by Fraunhofer ISE's Dr. Daniel Biro and 'Advantages and drawbacks of immersion-tin surfaces' by TechnoLab's Lutz Bruderreck.
Commenting on the forthcoming technology days, Rehm Thermal Systems CEO, Johannes Rehm, explains: "The past two decades have seen us grow from our origins as a two-man company working out of 45 square metres, to a global force in electronics and solar energy with factories in Germany, China and Russia. So, now is the time for a celebration of the innovation that has led us to this point – which will be very much in evidence at our Technology Days. As well as informative presentations, workshops and displays, we will also be giving visitors an opportunity to take a tour of our state-of-the-art production facilities. In addition to a working SMD line and technology displays from our partners, we'll also be showcasing a demo-line of the metallization process for solar cell production. There really will be something for everyone at the Rehm Technology Day – we look forward to the opportunity to celebrate innovation with many of our customers and colleagues!"
Workshops at the Rehm Technology Day include a focus on VisionXP with Pyrolysis, highlighting convection soldering with flexible systems engineering. The Rehm team will also be helping attendees get to grips with Backside Reflow Soldering with multi-functional technology, in addition to Vacuum Soldering with Condenso, highlighting how a controlled, reproducible vacuum-process leads to void-free solder joints and reliable PCBs. Attendees will also be invited to attend a workshop on solar cell metallization, during which Rehm representatives will explain how the process is significantly enhanced by the RDS Solar Dryer and the RFS Fast-Firing System. To register for the event, contact Carmen Hilsenbeck (email: C.firstname.lastname@example.org)
About Rehm Thermal Systems
Rehm Thermal Systems (www.rehm-group.com) is an international supplier to the photovoltaic and electronics industries, specializing in curing, drying and firing technologies as well as convection and condensation soldering. Rehm operates vertically integrated manufacturing facilities in Germany, China, and Russia, and technical support facilities throughout Europe, Asia and North America.