Scanning electron micrograph image showing platinum wires being lifted away from the surface of the UNCD electrode. Inset: Higher magnification image showing a single ring of platinum removed from the UNCD surface.
The process involves fabrication of wafer-level electrochemical cells consisting of alternating insulating and conducting UNCD thin films. Unique electrochemical properties of electrically conducting nitrogen incorporated UNCD not only provide a robust electrode platform for electro-deposition of micro/nanowires of various materials, but also facilitate easy peeling-off of deposited micro/nanowires for repeat use.
This bench-top technique is easy and quickly produces patterned nanowires on a large scale with diameters that are not predefined by the template, and do not require vacuum or clean-room processing. This offers a path for studying nanoscale phenomena and allows for process-scale development of a new generation of nanowire-based devices.