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Posted: September 11, 2007
Palomar Technologies Presents Methods to Improve Wire Bonding and Ball Bumping Geometries
(Nanowerk News) Palomar Technologies, provider of precision automation equipment and process development and assembly services, will present “Geometry and Bond Improvements for Wire Ball Bonding and Ball Bumping” at the International Wafer-Level Packaging Conference on September 19, 2007 at 3:00 PM at the Wyndham Hotel, San Jose, CA. The paper, written by Palomar’s senior scientist Dan Evans, focuses on improving stitch bond formation of ball bumps in products such as wireless phones, PDAs, and digital cameras. Steven Buerki, northwest regional account manager, will present.
Adaptive Bond Deformation™, a method developed to control the geometry of both ball and stitch according to specified process parameters, will be discussed. This technique adapts to normal variations in bond surface, bond tool coupling, part fixture, and other difficult-to-measure influences to produce bonded ball bumps and stitches with significant improvement in geometry consistency with similar or better results for ball shear and pull strength when compared to non-adaptive bonding.
The fourth annual International Wafer-Level Packaging Conference (IWLPC), sponsored jointly by the SMTA and Chip Scale Review magazine, held September 17-19, 2007 at the Wyndham Hotel in San Jose, CA, explores cutting-edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging including 3D/Stacked/CSP/SiP/SoP and mixed technology packages.
About Palomar Technologies
Palomar Technologies (formerly part of Hughes Aircraft Company) is one of the world’s principal suppliers of automated high-precision wire bonders and component placement systems along with process development and assembly services to increase yield and lower costs for manufacturers of optoelectronic, RF, and microelectronic packages in the photonics, wireless, microwave, automotive, aerospace, medical, LED, solar, and life sciences industries.
For more information, visit www.palomartechnologies.com or contact (760) 931-3600.