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Posted: Jun 06, 2012
Solid State Equipment LLC Joins SEMATECH's 3D Interconnect Program at UAlbany NanoCollege
(Nanowerk News) Solid State Equipment LLC (SSEC), a manufacturer of single wafer wet processing equipment for the semiconductor industry, has joined SEMATECH's 3D Interconnect program at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany, and will partner with SEMATECH to develop robust, cost-effective process and metrology solutions for readying high-volume via-mid through-silicon via (TSV) manufacturing.
The collaboration between SSEC and engineers in SEMATECH's 3D Interconnect program at CNSE's Albany NanoTech Complex will include evaluation and development of leading-edge wafer thinning and TSV wafer cleaning processes. Specifically, SMEATECH will utilize various SSEC process platforms for silicon etching, via reveal height metrology and wet cleaning.
"3D integration offers a path for higher performance, higher density, higher functionality, smaller form factor, and potential cost reduction," said John Voltz, Director of Global Field Operations for SSEC. "By joining SEMATECH's 3D Interconnect program and collaborating with industry-leading partners, we expect to play a critical role in addressing industry infrastructure and technology gaps in equipment, integration and product related issues for high volume adoption of through-silicon vias."
"SEMATECH is constantly strengthening and growing our strategic network alliances with leading-edge equipment and materials suppliers," said Sitaram Arkalgud, director of SEMATECH's 3D interconnect program. "We are excited by this opportunity to partner with SSEC. Such partnerships coupled with SEMATECH's leading edge R&D capabilities for advanced 3D IC know-how will contribute to the growth of the semiconductor industry."
"The addition of Solid State Equipment LLC to CNSE's Albany NanoTech Complex further underscores Governor Andrew Cuomo's declaration that New York is open for business," said Richard Brilla, CNSE vice president for strategy, alliances and consortia. "We look forward to working with SSEC as part of the CNSE-SEMATECH partnership, which is playing a vital role in driving technological progress and economic development."
Through technology leadership and global collaboration, SEMATECH's 3D Interconnect program emphasis is on exploring 3D technology options that provide cost-effective and reliable solutions to drive manufacturing readiness of 3D TSV.
About Solid State Equipment LLC
Founded in 1965 and headquartered in Horsham, Pennsylvania, Solid State Equipment LLC dba SSEC, is a leading manufacturer of single wafer wet processing equipment for the Advanced Packaging, Compound Semiconductor and Silicon Semiconductor Industries. Solid State Equipment maintains worldwide sales and technical service offices in Horsham, Pennsylvania; San Jose, California; Regensburg, Germany; Cramlington, England; Taiwan, R.O.C.; Shanghai, P.R.C; Woodlands, Singapore; Gyeonggi, R.O.K.; and Laguna, Philippines.
SEMATECH®, the international consortium of leading semiconductor device, equipment, and materials manufacturers, this year celebrates 25 years of excellence in accelerating the commercialization of technology innovations into manufacturing solutions. Through our unwavering commitment to foster collaboration across the nanoelectronics industry, we help our members and partners address critical industry transitions, drive technical consensus, pull research into the industry mainstream, improve manufacturing productivity, and reduce risk and time to market. Information about SEMATECH can be found at www.sematech.org.
The UAlbany CNSE is the first college in the world dedicated to education, research, development and deployment in the emerging disciplines of nanoscience, nanoengineering, nanobioscience and nanoeconomics. With more than $14 billion in high-tech investments, CNSE represents the world's most advanced university-driven research enterprise, offering students a one-of-a-kind academic experience and providing over 300 corporate partners with access to an unmatched ecosystem for leading-edge R&D and commercialization of nanoelectronics and nanotechnology innovations. CNSE's footprint spans upstate New York, including its Albany NanoTech Complex, an 800,000-square-foot megaplex with the only fully-integrated, 300mm wafer, computer chip pilot prototyping and demonstration line within 85,000 square feet of Class 1 capable cleanrooms. More than 2,700 scientists, researchers, engineers, students and faculty work here, from companies including IBM, Intel, GlobalFoundries, SEMATECH, Samsung, TSMC, Toshiba, Applied Materials, Tokyo Electron, ASML and Novellus Systems. An expansion now underway, part of which will house the world's first Global 450mm Consortium, will add nearly 500,000 square feet of next-generation infrastructure, an additional 50,000 square feet of Class 1 capable cleanrooms, and more than 1,000 scientists, researchers and engineers from CNSE and global corporations. In addition, CNSE's Solar Energy Development Center in Halfmoon provides a prototyping and demonstration line for next-generation CIGS thin-film solar cells. CNSE's Smart System Technology and Commercialization Center of Excellence (STC) in Rochester offers state-of-the-art capabilities for MEMS fabrication and packaging. CNSE also co-founded and manages operations at the Computer Chip Commercialization Center at SUNYIT in Utica and is a co-founder of the Nanotechnology Innovation and Commercialization Excelerator in Syracuse. For information, visit www.cnse.albany.edu