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Posted: September 26, 2007
Ormecon Introducing Ultrathin New Organic Nanometal Surface Finish in Commercial Scale
(Nanowerk News) A completely new nano size surface finish is introduced by Ormecon International
into the Printed Circuit Board market. The thickness is only 55 nanometres, the layer
consists of a nanoparticle complex formed between the Organic Nanometal and Silver
(the Silver only contributes up less than 10% to it).
Nonetheless, this ultrathin layer provides a much more powerful oxidation protection
and solderability preservation than any other established metallic finish like ENIG,
Immersion Silver, Immersion Tin or OSP – although the established finishes are
between 6 and 100 times thicker than this new nanofinish.
According to Ormecon, several tests in PCB manufacturers and assemblers have
already shown a superior thermal resistance and perfect solderability also under
lead-free multi-reflow conditions.
Only three months after the first public presentation by Dr. Bernhard Wessling, the
inventor and Ormecon CEO in July 2007, a first industrial line for the deposition of
the new nanofinish will be installed in Korea at Ormecon’s customer YooJin. The line
will go into operation in the second half of October.
It will be the first commercial line to provide a nano sized surface finish for printed
The energy consumption will only be 10 – 30%, the total environmental resource
consumption is less than 1% compared to conventional surface finish processes.
Technical information, external test reports and a discussion of the environmental
aspects are available on Ormecon’s website www.ormecon-nanotech.com.