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Posted: October 31, 2007
Oxford Instruments Adds New Dual-Mode Dry Etch Tool to Failure Analysis Line-up
(Nanowerk News) Oxford Instruments, the high-technology tools and systems company, is pleased to announce the addition of the Plasmalab®µEtchEL dry etch tool to its Failure Analysis product line. The PlasmalabµEtchEL is a flexible and economic entry-level tool which still offers the switchable dual-mode PE/RIE (plasma etch/reactive ion etch) capability found on the company's PlasmalabµEtch200 and PlasmalabµEtch300 systems.
The dual-mode PE/RIE configuration enables processes to be run for isotropic Polyimide removal (RIE), isotropic SiNx removal (PE) and anisotropic IMD/ILD etch (RIE) in a single tool, for small die or packaged devices through to 200 mm wafers. The PlasmalabµEtchEL offers outstanding uniformity with excellent reproducibility and selectivity, promising clean removal of Polyimide, nitrides and oxides to reveal the underlying device structure for the desired analysis.
Oxford Instruments offers a unique family of dry etch de-processing solutions for Failure Analysis using PE, RIE and ICP (inductively coupled plasma) technologies, with over 100 tools installed across the world. These flexible tools allow a range of processes from passivation removal to anisotropic oxide removal, from small die or packaged chip through to 300 mm wafer, in a compact footprint with convenient open-loading of samples. With its global service and support team, Oxford Instruments gives worldwide hardware and process support to its customers in addition to the process guarantees provided from its own Applications Laboratory.
About Oxford Instruments plc
Oxford Instruments designs, supplies and supports high-technology tools, processes and solutions with a focus on physical science, bioscience, environmental and industrial research and applications. It provides solutions needed to advance fundamental nanoscience research and its transfer into commercial nanotechnology applications. Innovation has been the driving force behind Oxford Instrumentsí growth and success for over 40 years, and its strategy is to effect the successful commercialisation of these ideas by bringing them to market in a timely and customer-focused fashion.
The first technology business to be spun out from Oxford University over forty years ago, Oxford Instruments is now a global company with over 1,300 staff worldwide and a listing on the London Stock Exchange (OXIG). Its objective is to be the leading provider of new generation tools and systems for the Physical Science and Bioscience sectors.
This involves the combination of core technologies in areas such as low temperature and high magnetic field environments, Nuclear Magnetic Resonance, X-ray electron and optical based metrology, and advanced growth, deposition and etching. Our products, expertise, and ideas address global issues such as energy, environment, terrorism and health and are part of the next generation of telecommunications, energy products, environmental measures, security devices, drug discovery and medical advances.
About Oxford Instruments Plasma Technology
Oxford Instruments Plasma Technology offers flexible, configurable process tools and leading-edge processes for the precise, controllable and repeatable engineering of micro- and nano-structures. Our systems provide process solutions for nanometre layer epitaxial growth of compound semiconductor material, etching of nanometre sized features and the controlled growth of nanostructures. These solutions are based on core technologies in plasma-enhanced deposition and etch, ion-beam deposition and etch, atomic layer deposition and molecular beam epitaxy. Products range from compact stand-alone systems for R&D, through batch tools and up to clustered cassette-to-cassette platforms for high-throughput production processing.