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Posted: January 4, 2008
Fifth International Wafer-Level Packaging Conference Set for Oct. 13-16
(Nanowerk News) The fifth annual International Wafer-Level Packaging Conference and Tabletop Exhibition will expand to four days in 2008, beginning on October 13 and ending on October 16 in San Jose, CA.
The workshop program is now being created and will include half-day workshops by experts that include Dr. Ken Gilleo, renowned inventor, international lecturer, and author of seven McGraw-Hill books on semiconductors, MEMS and nanotechnology trends and packaging. Dr. Gilleo will present two workshops that feature MEMS and nanotechnology.
Professional workshops, in addition to MEMS, will cover many aspects of 3D/stacked packaging, flip chips, testing advanced devices, wafer-level packaging and emerging technologies—such as the design and fabrication of through-silicon vias.
Emerging technologies will include a new workshop on solar processing and packaging and a panel discussing how photovoltaics will impact the semiconductor and allied industries.
The annual keynote dinner will be held on October 15. Dr. Thomas H. Di Stefano, whose pioneer work as a founder of Tessera in San Jose helped propel chip-scale packaging into the mainstream, is the keynote speaker. Dr. Di Stefano is now president and CEO of Centipede Systems, San Jose.
Each day will also feature more than 50 companies exhibiting and demonstrating their products and services for conference attendees. Requests for exhibit space should be directed to Leslee Johns at SMTA, email@example.com .
“Through our promotion of chip-scale- and wafer-level packaging prior to 2003, the Conference has become a mandatory venue for industry expanding knowledge of the technology,” said Gene Selven, conference co-administrator and publisher of Chip Scale Review.