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Posted: February 21, 2008

Applied Materials to Host Forum to Discuss Critical 32nm Patterning Challenges

(Nanowerk News) With 32nm technologies ramping within the next two years, implementing production-worthy techniques to address advanced patterning requirements becomes device makers’ primary concern. On February 27th Applied Materials, Inc. will host a full day of technical presentations to discuss strategies and solutions to meet these scaling challenges. Experts will address critical patterning issues, from design automation to new process and inspection methodologies.
Dr. Hans Stork, chief technology officer of Applied’s Silicon Systems Group, will lead this important forum, titled “Reality Takes Shape: Patterning at 32nm”. The event will feature distinguished speakers from AMD, Cadence Design Systems, Freescale Semiconductor, Hynix, IBM, Qimonda, SEMATECH and Tower Semiconductor.
  • Self-aligned double patterning
  • Immersion lithography
  • OPC and electrical simulation modeling
  • Etch for patterning beyond 32nm
  • Where: The Sainte Claire Hotel, 302 S Market St, San Jose, CA 95113
    When: Wednesday, February 27th, 2008
    For more information on this exciting event, please visit
    Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in Nanomanufacturing Technology™ solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panel displays, solar photovoltaic cells, flexible electronics and energy efficient glass. At Applied Materials, we apply Nanomanufacturing Technology to improve the way people live. Learn more at
    Source: Applied Materials
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